| Author Name | Affiliation | | WANG Guang-jun | School of Materials Science and Engineering,Central South University,Changsha 410083,China | | WANG De-zhi | School of Materials Science and Engineering,Central South University,Changsha 410083,China | | Zhou Jie | School of Materials Science and Engineering,Central South University,Changsha 410083,China | | WU Zhuang-zhi | School of Materials Science and Engineering,Central South University,Changsha 410083,China |
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| Abstract: |
| The molybdenum powders with average particle size of 3 μm were coated with copper by electroless plating. The influence of pretreatment,solution composition and plating conditions on electroless copper plating was studied. The copper-coated molybdenum powders were examined by SEM and XRD. Results indicate that a series of optimization methods is used to add activated sites before electroless copper plating. Taking TEA and EDTA as chief and assistant complex agents respectively,2,2’-bipyridyl and PEG as double stabilizers,the Mo powders are coated with copper successfully with little Cu2O contained,at the same time,Mo-Cu composite powders with copper content of 15-85 wt% can be obtained. The optimal values of pH,temperature and HCHO concentration are 12-13,60-65 ℃ and 22-26 mL/L,respectively. |
| Key words: Mo-Cu electroless copper plating powders |
| DOI：10.11916/j.issn.1005-9113.2009.03.017 |
| Clc Number:TQ153.1 |
| Fund: |
