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Supervised by Ministry of Industry and Information Technology of The People's Republic of China Sponsored by Harbin Institute of Technology Editor-in-chief Yu Zhou ISSNISSN 1005-9113 CNCN 23-1378/T

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Related citation:MENG Gong-ge,TAKEMOTO Tadashi,NISHIKAWA Hiroshi.Effect of elements Ni and Co on morphology and type of IMC at Sn-3Ag-0.5Cu solder joint interface[J].Journal of Harbin Institute Of Technology(New Series),2009,16(5):648-651.DOI:10.11916/j.issn.1005-9113.2009.05.010.
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Effect of elements Ni and Co on morphology and type of IMC at Sn-3Ag-0.5Cu solder joint interface
Author NameAffiliation
MENG Gong-ge School of Material Science & Engineering,Harbin University of Science and Technology,Harbin 150040,China 
TAKEMOTO Tadashi Joining and Welding Research Institute,Osaka University,Osaka 567-0047,Japan 
NISHIKAWA Hiroshi Joining and Welding Research Institute,Osaka University,Osaka 567-0047,Japan 
Abstract:
The intermetallic compound (IMC) is hard and brittle,and its forming and growth at soldering joint interface is an important issue in joint reliability.The data obtained by digital optical electronic microscope indicate that the addition of element Co changes the IMC morphology from ball-like and bar-like to distinct and sharp in crest lines and edges.The addition of elements Ni and Co in Sn-3Ag-0.5Cu solder promotes the nucleation and makes the IMC size finer.The electron probe microanalysis (EPMA) determines the chemical compositions and confirms that the IMC is changed into the (Cu,Co,Ni)6Sn5+(Cu,Co,Ni)3Sn4 mixed type from the type of Cu6Sn5 with the elements Ni and Co in the solder.
Key words:  Sn-3Ag-0.5Cu solder  IMC  Ni/Co  morphology  type
DOI：10.11916/j.issn.1005-9113.2009.05.010
Clc Number:TG407
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