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Supervised by Ministry of Industry and Information Technology of The People's Republic of China Sponsored by Harbin Institute of Technology Editor-in-chief Yu Zhou ISSNISSN 1005-9113 CNCN 23-1378/T

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Related citation:Luoyi,ZHANG Yan-guo,ZHANG Zong-bo.Hot embossing of micro energy director for micro polymer fusion ultrasonic bonding[J].Journal of Harbin Institute Of Technology(New Series),2011,(6):139-142.DOI:10.11916/j.issn.1005-9113.2011.06.026.
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Hot embossing of micro energy director for micro polymer fusion ultrasonic bonding
Author NameAffiliation
Luoyi Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116023,China 
ZHANG Yan-guo Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116023,China 
ZHANG Zong-bo Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116023,China 
Abstract:
In order to use micro ultrasonic bonding technique to package polymer microfluidic chips,an auxiliary microstructure named micro energy director is designed and fabricated.The hot embossing process for PMMA (polymethyl methacrylate) substrates with both concave micro channel and convex micro energy director for ultrasonic bonding is studied.The embossing processes with different embossing temperatures are simulated using Finite Element Method (FEM).The optimized parameters are:the embossing temperature of 135 ℃,holding time of 200 s,and the embossing pressure of 1.65 MPa.The experimental results show that the replication error between experiments and simulations is less than 2% and the replication accuracy of the microstructure is more than 96%.The study offers a method for quick optimizing parameters for hot embossing both concave and convex microstructures.
Key words:  hot embossing  micro energy director  micro polymer fusion ultrasonic bonding
DOI：10.11916/j.issn.1005-9113.2011.06.026
Clc Number:TG453.9
Fund:

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