Please submit manuscripts in either of the following two submission systems

    ScholarOne Manuscripts

  • ScholarOne

    • 勤云稿件系统

  • 登录

Search by Issue

  • 2024 Vol.31
  • 2023 Vol.30
  • 2022 Vol.29
  • 2021 Vol.28
  • 2020 Vol.27
  • 2019 Vol.26
  • 2018 Vol.25
  • 2017 Vol.24
  • 2016 vol.23
  • 2015 vol.22
  • 2014 vol.21
  • 2013 vol.20
  • 2012 vol.19
  • 2011 vol.18
  • 2010 vol.17
  • 2009 vol.16
  • No.1
  • No.2

Search by Keywords

  • Search by Title
  • Search by Keywords
  • Search by Abstract
  • Search by Author's Chinese Name
  • Search by Author's English Name
  • Search by Fund

News & AnnouncementMORE

Supervised by Ministry of Industry and Information Technology of The People's Republic of China Sponsored by Harbin Institute of Technology Editor-in-chief Yu Zhou ISSNISSN 1005-9113 CNCN 23-1378/T

期刊网站二维码
微信公众号二维码
Related citation:Luoyi,ZHANG Yan-guo,ZHANG Zong-bo.Hot embossing of micro energy director for micro polymer fusion ultrasonic bonding[J].Journal of Harbin Institute Of Technology(New Series),2011,(6):139-142.DOI:10.11916/j.issn.1005-9113.2011.06.026.
【Print】   【HTML】   【PDF download】   【View/Add Comment】  【Download reader】  【 Close 】
←Previous|Next→ Back Issue    Advanced Search
This paper has been: browsed 791times   downloaded 336times 本文二维码信息
码上扫一扫！
Shared by: Wechat More
Font:larger+|default|smaller-
Hot embossing of micro energy director for micro polymer fusion ultrasonic bonding
Author NameAffiliation
Luoyi Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116023,China 
ZHANG Yan-guo Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116023,China 
ZHANG Zong-bo Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116023,China 
Abstract:
In order to use micro ultrasonic bonding technique to package polymer microfluidic chips,an auxiliary microstructure named micro energy director is designed and fabricated.The hot embossing process for PMMA (polymethyl methacrylate) substrates with both concave micro channel and convex micro energy director for ultrasonic bonding is studied.The embossing processes with different embossing temperatures are simulated using Finite Element Method (FEM).The optimized parameters are:the embossing temperature of 135 ℃,holding time of 200 s,and the embossing pressure of 1.65 MPa.The experimental results show that the replication error between experiments and simulations is less than 2% and the replication accuracy of the microstructure is more than 96%.The study offers a method for quick optimizing parameters for hot embossing both concave and convex microstructures.
Key words:  hot embossing  micro energy director  micro polymer fusion ultrasonic bonding
DOI：10.11916/j.issn.1005-9113.2011.06.026
Clc Number:TG453.9
Fund:

LINKS

Copyright © The Editorial Department of Journal of Harbin Institute of Technology
Address: 92 West Dazhi Street, Nan Gang District, Harbin, Heilongjiang Province, China Postcode: 150001
(C)2015 JOURNAL OF HIT ALL RIGHTS RESERVED. ICP. 0000423255