| Author Name | Affiliation | | LIU Yu-yan | School of Chemical Engineering and Technology, Harbin Institute of Technology, Harbin 150001, China | | LI Li | School of Chemical Engineering and Technology, Harbin Institute of Technology, Harbin 150001, China
Dept. of Materials Science and Engineering, Carnegie Mellon University, USA | | WU Song-quan | School of Chemical Engineering and Technology, Harbin Institute of Technology, Harbin 150001, China | | TANG Yu-pan | School of Chemical Engineering and Technology, Harbin Institute of Technology, Harbin 150001, China |
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| Abstract: |
| One chemical approach using nitric acid as the solvent to decompose thermosetting epoxy resin was discussed. The samples were prepared by using different kinds of curing agents, namely polyamide (PA651), isophorone diamine (IPDA), 4,4'-diaminodiphenylmethane (DDM) and 2-ethyl-4-methy-imidazole (EMI—2,4) and different kinds of epoxy resins, namely bisphenol-A epoxy resin(E-44), bisphenol-A epoxy resin(E-51), N,N,N',N' teraglycidy 4,4' diaminodiphenyl methane (AG-80) and diglycidyl-4,5-epoxycyclohexane-1,2-dicarboxylate (TDE-85). Their effects on decomposition rate were investigated and the decomposition products were analyzed by Infra-red (IR) spectra, and Gas Chromatography-Mass Spectrometry (GC-MS). Based on conclusions drawn from experiments, the mechanism of degrading thermosetting epoxy resin with nitric acid was envisaged tentatively. |
| Key words: epoxy resin nitric acid chemical decomposition |
| DOI：10.11916/j.issn.1005-9113.2012.04.004 |
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