| Author Name | Affiliation | | Ping Xue | Optic ＆ Electronic Engineering Research Center, Harbin University of Science and Technology, Harbin 150080, China | | Chang-Hong Jia | Optic ＆ Electronic Engineering Research Center, Harbin University of Science and Technology, Harbin 150080, China | | Xu-Sheng Wang | Optic ＆ Electronic Engineering Research Center, Harbin University of Science and Technology, Harbin 150080, China | | Hao Sun | Optic ＆ Electronic Engineering Research Center, Harbin University of Science and Technology, Harbin 150080, China |
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| Abstract: |
| In this paper, high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature, LED heat sink to surface temperature distribution is studied directly in the test, and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application. |
| Key words: thermal resistance junction temperature integrated high power LED cooling |
| DOI：10.11916/j.issn.1005-9113.2013.02.020 |
| Clc Number:TN371 |
| Fund: |
