| Related citation: | Meng-Han Wang,Wen-Hao Wang,Hai Yang,Jie Zhou.Dynamic Recrystallization Prediction During Double Cup Extrusion by Cellular Automata Coupled with Finite Analysis Method[J].Journal of Harbin Institute Of Technology(New Series),2013,20(4):99-108.DOI:10.11916/j.issn.1005-9113.2013.04.016. |
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| Author Name | Affiliation | | Meng-Han Wang | School of Material Science and Engineering, Chongqing University, Chongqing 400044, China | | Wen-Hao Wang | School of Material Science and Engineering, Chongqing University, Chongqing 400044, China | | Hai Yang | School of Material Science and Engineering, Chongqing University, Chongqing 400044, China | | Jie Zhou | School of Material Science and Engineering, Chongqing University, Chongqing 400044, China |
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| Abstract: |
| In order to investigate the microstructure evolution during a hot extrusion process, a cellular automata (CA) coupled with finite element method (FEM) was developed to numerically simulate the dynamic recrystallization (DRX). Firstly, the cellular automata model was modified by introducing thermomechanical parameters under the isothermal hot compression conditions. Then, the modified CA was verified by the experimental average grain size which was obtained by the hot compression of cylindrical specimens. After that, the modified CA was used to predict the microstructure evolution during a double cup extrusion by combining with the finite element method. The results showed that the strain rate and the temperature are sensitive to the average grain size while the strain can affect the DRX fraction greatly. In addition, the CA model can predict the final microstructure successfully and is able to simulate the DRX phenomenon for a wide range of deformation conditions. It also revealed that the results obtained by CA model are consistent with the ones acquired by finite element analysis. |
| Key words: cellular automata computer simulation dynamic recrystallization microstructure |
| DOI：10.11916/j.issn.1005-9113.2013.04.016 |
| Clc Number:TG146.2 |
| Fund: |
