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Supervised by Ministry of Industry and Information Technology of The People's Republic of China Sponsored by Harbin Institute of Technology Editor-in-chief Yu Zhou ISSNISSN 1005-9113 CNCN 23-1378/T

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Related citation:Ai-Gang Pan,Jun-Biao Wang,Xian-Jie Zhang,Xiao-Bao Cao.Experimental Research of Electronic Devices Thermal Control Using Metallic Phase Change Materials[J].Journal of Harbin Institute Of Technology(New Series),2014,(2):113-121.DOI:10.11916/j.issn.1005-9113.2014.02.017.
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Experimental Research of Electronic Devices Thermal Control Using Metallic Phase Change Materials
Author NameAffiliation
Ai-Gang Pan Shaanxi Engineering Research Center of Digital Manufacturing Technology, Northwestern Polytechnical University, Xi’an 710072, China 
Jun-Biao Wang Shaanxi Engineering Research Center of Digital Manufacturing Technology, Northwestern Polytechnical University, Xi’an 710072, China 
Xian-Jie Zhang Shaanxi Engineering Research Center of Digital Manufacturing Technology, Northwestern Polytechnical University, Xi’an 710072, China 
Xiao-Bao Cao Shaanxi Engineering Research Center of Digital Manufacturing Technology, Northwestern Polytechnical University, Xi’an 710072, China 
Abstract:
A Phase-change thermal control unit (PTCU) filled with metallic phase change material (PCM) Bismuth alloy for electric devices thermal protection was developed and investigated experimentally. The PTCU filled with PCM was designed and manufactured. Resistance heating components (RCHs) produced 1 W, 3 W, 5 W, 7W, and 10 W for simulating heat generation of electronic devices. At various heating power levels, the performance of PTCU were tested during heating period and one duty cycle period. The experimental results show that the PTCU delays RCH reaching the maximum operating temperature. Also, a numerical model was developed to enable interpretation of experimental results and to perform parametric studies. The results confirmed that the PTCU is suitable for electric devices thermal control.
Key words:  bismuth alloy  metallic phase change materials  thermal control  electronic device
DOI:10.11916/j.issn.1005-9113.2014.02.017
Clc Number:TB333
Fund:

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