| Author Name | Affiliation | Postcode | | Adel Elgadi | Center for Advanced Materials Research and Manufacturing Processes, Faculty of Engineering and the Built Environment, SEGi University, Petaling Jaya 47810, Selangor, Malaysia | 47810 | | Chan Mieow Kee* | Center for Advanced Materials Research and Manufacturing Processes, Faculty of Engineering and the Built Environment, SEGi University, Petaling Jaya 47810, Selangor, Malaysia | 47810 | | Tan Yong Chai | Center for Advanced Materials Research and Manufacturing Processes, Faculty of Engineering and the Built Environment, SEGi University, Petaling Jaya 47810, Selangor, Malaysia | 47810 |
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| Abstract: |
| Low thermal conductivity of binary fatty acid mixture of palmitic and lauric acids (PA-LA) within the value range of 0.15 – 0.17 W/(m.K) restricts its wide utilization as thermal energy storage material in the active regime of solar heating applications at low operating temperatures. Nevertheless, this mixture as phase change material (PCM) has a suitable phase-change temperature and heat of 36 ℃ and 176.3 J/g, respectively. Hence, the objective of this study is to formulate a novel form-stable composite PCM with the PA-LA mixture and expanded graphite (EG) as a thermal enhancer. PA-LA eutectic mixture with varied concentrations of EG was prepared and characterized. The thermal conductivity of PA-LA/EG increased gradually with the mass of EG. Optimum thermal properties were observed in PA-LA/(5% EG) composite, where its melting, freezing temperature , latent melting heat and thermal conductivity was 35.53 ℃, 34.84 ℃, 174 J/g, and 1.19 W/(m.K), respectively. Also, the composite PCM is characterized by good chemical-thermal stability and thermal reliability for long-term usage. In conclusion, it can be utilized as a prospective form-stable PCM for thermal energy storage in solar heating systems, overheat treatment systems, and other thermal storage applications at low operating temperatures. |
| Key words: binary mixture PCM of fatty acid expanded graphite thermal conductivity thermal reliability and stability |
| DOI： |
| Clc Number:TB35 |
| Fund: |
