| Author Name | Affiliation | Postcode | | Nur Amirah Mohd Zahri | Department of Mechanical Engineering,Faculty of Engineering,University of Malaya,Kuala Lumpur 50603,Malaysia | 50603 | | Farazila Yusof* | Department of Mechanical Engineering, Faculty of Engineering and Advanced Manufacturing & Material Processing (AMMP Centre), University of Malaya, Kuala Lumpur 50603, Malaysia | 50603 | | Yukio Miyashita | Department of Mechanical Engineering, Nagaoka University of Technology, Nagaoka 940-2188, Japaniversity of Technology,Nagaoka -,Japan | | | Tadashi Ariga | Department of Metallurgical Engineering, Tokai University, Hiratsuka 259-1292, Japan | | | A. S. Md. Abdul Haseeb | Department of Mechanical Engineering, Faculty of Engineering and Centre of Advanced Materials (CAM), University of Malaya, Kuala Lumpur 50603, Malaysiaof Malaya,Kuala Lumpur ,Malaysia | | | Nazatul Liana Sukiman | Department of Mechanical Engineering, Faculty of Engineering and Centre of Advanced Materials (CAM), University of Malaya, Kuala Lumpur 50603, Malaysia | |
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| Abstract: |
| The effect of the pore density of porous copper (Cu) on brazed Cu/porous Cu was investigated. A filler with a composition of Cu-9.0Sn-7.0Ni-6.0P (Sn: Tin; Ni: Nickel; P: Phosphorus) and porous Cu with pore densities of 15 pores per inch (PPI), 25 PPI, and 50 PPI were employed. The joint strength of Cu/porous Cu was evaluated with shear tests at different brazing temperatures. Characterizations of the joint interface and fractured surface were achieved with scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDX), and X-ray diffraction (XRD). The micro-hardness test of Cu/porous Cu joint interface showed a high hardness value (HV) for 50 PPI porous Cu. This result was in line with its low shear strength. It was proved that the joint strength of Cu/porous Cu is dependent on the pore density of the porous Cu structure and brittle phases of Cu3P and Ni3P in the brazed interface. |
| Key words: porous metal brazing interface microstructure shear fracture |
| DOI：10.11916/j.issn.1005-9113.2020056 |
| Clc Number:TG4 |
| Fund: |
