| 摘要: |
| 以Sn-0.7Cu无铅焊料合金为基础，研究P元素含量对合金微观组织、熔程、润湿性和抗氧化性能的影响。将纯锡和中间合金Sn-10Cu和Sn-3.5P按质量比在270℃熔化，保温20min后搅拌均匀，浇铸冷却后制备成Sn-0.7Cu-xP（x=0-0.1）焊料合金。通过光学显微镜观察焊料合金的显微组织，采用X射线衍射仪（XRD）进行焊料合金的物相分析，通过差示扫描量热分析仪（DSC）进行焊料合金熔点测定，采用润湿平衡法测定焊料的润湿性，采用静态刮渣法测定焊料的抗氧化性。结果表明：焊料合金晶粒随着P元素含量的升高而增加；焊料合金的熔程随着P元素含量的升高先增加后降低；焊料的润湿时间随着P元素含量的增加先减小后增大，润湿力随着P元素含量的增加而减小，在P含量为0.001%时润湿性较好；P元素含量为0. 01%时，Sn-0.7Cu的抗氧化性能较好。 |
| 关键词: Sn-0.7Cu P 显微组织 润湿性 抗氧化性能 |
| DOI：10.11951/j.issn.1005-0299.20180017 |
| 分类号: |
| 基金项目:国家自然科学(51362017) |
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| Effect of P on Properties of Sn-0.7Cu lead-free Solder Alloy |
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YAN Jikang, CHEN Dongdong, GAN Youwei, GAN Guoyou, YI Jianhong
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Faculty of Materials Science and Engineering,Kunming University of Science and Technology
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| Abstract: |
| Sn-0.7Cu lead-free solder alloy was selected as a base alloy,the effects of P content on microstructure, melting range, wettability and oxidation resistance of the solder alloy were investigated. The pure tin and master alloys Sn-10Cu and Sn-3.5P were melted at 270℃ according to the mass ratio. After 20min insulation, the alloys were stirred evenly, and then the Sn-0.7Cu-xP (x=0-0.1) solder alloys were prepared after casting and cooling. The microstructure of the solder alloys were observed by optical microscope, and the phase analysis of the solder alloys were analyzed by x-ray diffractometer(XRD),and the melting point of the solder alloys were analyzed by differential scanning calorimetry(DSC), and the wettability of the solder on Cu substrate was investigated by wetting balance testing method.The results show that the grain size of solder alloy increase with the increase of the P content;the melting range of solder alloy first increase and then decrease with the increase of the P content; The wetting time of solder alloy first decrease and then increase with the increase of P content，the wetting force of solder alloy decrease with the increase of the P content,and when the P content was 0.001%, Sn-0.7Cu had better wettability;When the P content was 0.01%,the oxidation resistance of the Sn-0.7Cu were better. |
| Key words: Sn-0.7Cu P microstructure wettability oxidation resistance |
