| 引用本文: | 吴琰,王长瑞,田威,陈威,何佳雯.脉冲电流扩散连接金刚石/铜微流道热沉的微观组织和性能演变[J].材料科学与工艺,2026,(1):1-9.DOI:10.11951/j.issn.1005-0299.20240187. |
| WU Yan,WANG Changrui,TIAN Wei,CHEN Wei,HE Jiawen.Microstructure and performance evolution of heat sink in diamond/copper microchannels connected by pulse current diffusion[J].Materials Science and Technology,2026,(1):1-9.DOI:10.11951/j.issn.1005-0299.20240187. |
|
| 摘要: |
| 针对传统芯片微流道热沉壳体封装方式存在的易堵塞微流道、损伤金刚石/铜界面,进而影响散热性能的问题,本文提出了采用脉冲电流辅助扩散连接技术实现金刚石/铜微流道热沉的一体化精密成形方法。通过对不同工艺参数下连接试样的微观组织和力学性能进行分析,揭示了脉冲电流加热方式对金刚石基金属复合材料扩散连接的影响机理。结果表明:在真空度为10 Pa、扩散温度为850 ℃、扩散连接时间为30 min、中间层为厚度50 μm纯钼箔的条件下,金刚石/铜样件连接处形成了良好的连接界面,无明显缺陷,且连接试样热导率达到520 W/(m·K)以上。进一步研究发现,电流密度增大会导致扩散温度提高,界面处元素扩散活性增强,并形成Cu-Mo-Cu固溶体组织结构,使得焊接后样件的剪切强度最高达到了214 MPa。然而,过高的扩散温度会导致金刚石石墨化,严重影响金刚石/铜微流道热沉样件的散热性能和力学性能。因此,在提高界面结合性的同时,还需兼顾连接样件的散热性能。 |
| 关键词: 脉冲电流扩散连接 金刚石/铜复合材料 高效散热 微流道热沉 金属箔中间夹层 |
| DOI：10.11951/j.issn.1005-0299.20240187 |
| 分类号:TG456.3 |
| 文献标识码:A |
| 基金项目:国家自然科学基金资助项目(52075250,52175468)；江苏省自然科学基金资助项目(BK20211185). |
|
| Microstructure and performance evolution of heat sink in diamond/copper microchannels connected by pulse current diffusion |
|
WU Yan1,WANG Changrui1,2,TIAN Wei1,CHEN Wei3,HE Jiawen1
|
|
(1.School of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China; 2.Nanjing Ruiwei New Material Technology Co., Ltd., Nanjing 211511, China; 3.Southwest China Research Institute of Electronic Equipment, Chengdu 610036, China)
|
| Abstract: |
| Addressing the problems of microchannel blockage and diamond/copper interface damage in traditional packaging for microchannel heat sink shells, which hinder heat dissipation, this study introduces an integrated precision forming method for diamond/copper microchannel heat sinks. This method utilizes pulse current-assisted diffusion bonding technology. By examining the microstructure and mechanical properties of bonded samples under various process parameters, the study explores how pulsed current heating affects the diffusion bonding of diamond-based metal composites.The results show that under the conditions of vacuum pressure of 10 Pa, diffusion temperature of 850 ℃, bonding time of 30 minutes, and 50-micrometer-thick pure molybdenum foil interlayer, a defect-free bonding interface forms between the diamond and copper, achieving a thermal conductivity of over 520 W/(m·K).Further research reveals that raising the current density boosts diffusion temperature and interface diffusion activity, forming a Cu-Mo-Cu solid solution and increasing the shear strength to 214 MPa.However, excessively high temperatures can graphitize the diamond, adversely impacting the heat dissipation and mechanical properties of the samples. Thus, while enhancing interface bonding, it is crucial to maintain optimal heat dissipation performance. |
| Key words: pulse current diffusion bonding diamond/copper composite material efficient heat dissipation microchannel heat sink intermediate layer of metal foil |
