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| Abstract: |
| The popular radio frequency (RF) chip on board (COB) test has gradually taken the place of on-wafer test due to the high efficiency and high power. This paper presents the extended Open-Short-Load (OSL) that is one-port calibration method to verify the error model de-embedding in S parameter measurement. Three-level cascade structure on COB's system error model is proposed and analyzed. Four kinds of calibration plane solutions for de-embedding are verified. At last, on-board calibration (CAL) kits solution is established to decrease the system error to the least value. The maximum error shift can be controlled less than 0.1 dB comparing with the on-wafer test results. In general, the practical application results prove that this method is reasonable and effective and easy to be mastered. |
| Key words: S parameter COB de-embedding |
| DOI：10.11916/j.issn.1005-9113.15260 |
| Clc Number:TN06 |
| Fund: |
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| Descriptions in Chinese: |
| S参数去嵌策略在COB级的扩展 王磊1，2，张金艺1* （1，上海大学，特种光纤与光接入网省部共建重点实验室； 2，上海华虹宏力半导体制造有限公司） 创新点说明：本文提供一种单端口扩展OSL（开短-短路-负载）的校准方法，来验证COB级S参数误差模型的去嵌策略。 研究目的： 针对大功率射频器件和芯片验证的高效性和准确性，COB（载芯片板）级的测试已经逐步取代在片测试成为主流RF射频芯片测试的方案。 研究方法： 提出并分析了COB封装三级级联结构对系统误差模型的影响，制定了四种去嵌策略的验证方案并进行相对的测试结果比较。 结果： COB级校准件的建立和应用有效的减少系统误差，其最大误差范围可以控制在0.1dB以内，这与晶圆级去嵌的测试结果一致 结论： 实际应用结果表明，该方法是合理和有效的，易于掌握并且可在工程阶段扩展。 关键词：S 参数；COB；去嵌 |
