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Supervised by Ministry of Industry and Information Technology of The People's Republic of China Sponsored by Harbin Institute of Technology Editor-in-chief Yu Zhou ISSNISSN 1005-9113 CNCN 23-1378/T

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Related citation:Ruiting Tong,Bin Han,Tao Zhang,Zefen Quan,Geng Liu.Molecular Dynamics Simulation on Friction and Thermal Propertiesof FCC Copper in Nanoscale Sliding Contacts[J].Journal of Harbin Institute Of Technology(New Series),2022,29(2):24-33.DOI:10.11916/j.issn.1005-9113.21040.
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Molecular Dynamics Simulation on Friction and Thermal Propertiesof FCC Copper in Nanoscale Sliding Contacts
Author NameAffiliation
Ruiting Tong Shaanxi Engineering Laboratory for Transmissions and Controls, Northwestern Polytechnical University, Xi′an 710072, China 
Bin Han Jiangsu Automation Research Institute, Jiangsu Lianyungang 222061, China 
Tao Zhang China Academy of Launch Vehicle Technology, Beijing 100076, China 
Zefen Quan Shanghai Aircraft Design and Research Institute, Shanghai 200232, China 
Geng Liu Shaanxi Engineering Laboratory for Transmissions and Controls, Northwestern Polytechnical University, Xi′an 710072, China 
Abstract:
In nanoscale sliding contact, adhesion effects and adhesive force are predominant, and high friction force will be produced. Friction energy is mainly converted into heat, and the heat will make nanomaterials become soft to affect friction behaviors, so it is important to investigate the friction and thermal properties of the nanoscale sliding contacts. A model of a nanoscale sliding contact between a rigid cylindrical tip and an FCC copper substrate is developed by molecular dynamics simulation. The thermal properties of the substrate and the friction behaviors are studied at different sliding velocities and different tip radii. The results show that at a low sliding velocity, the friction force fluctuation is mainly caused by material melting-solidification, while at a high sliding velocity the material melting is a main factor for the friction reduction. The average friction forces increase at initial phase and then decrease with increasing sliding velocity, and the average temperature of the substrate increases as sliding velocity increases. Increasing tip radius significantly increases the temperature, while the coupled effects of tip radius and temperature rise make friction force increase slightly.
Key words:  molecular dynamics  friction property  thermal property  nanoscale sliding contact
DOI:10.11916/j.issn.1005-9113.21040
Clc Number:TH123
Fund:
Descriptions in Chinese:
  

面心立方单晶铜纳观滑动接触摩擦性能与热特性的分子动力学研究

佟瑞庭1,韩宾2,张涛3,权泽芬4,刘更1

(1. 西北工业大学 陕西省机电传动与控制工程实验室,西安 710072;

2.江苏自动化研究所,江苏 连云港 222061;

3.中国运载火箭技术研究院,北京 100076;

4.上海飞机设计研究院,上海 200232)

摘要:

在纳观滑动接触过程中,粘着效应和粘着力占主导地位,导致滑动接触表现出很高的摩擦力。绝大部分的摩擦功转化为摩擦热,而摩擦热会使纳米材料变软,并进一步影响摩擦行为,因此研究纳观滑动接触的摩擦性能与热特性具有重要意义。本文建立一个刚性圆柱压头与一个弹性基体纳观滑动接触问题的分子动力学模型。研究了不同滑动速度和不同压头半径情况下,基体的热特性以及摩擦行为。结果表明:在低速滑动时,摩擦力的波动主要是材料的熔化-凝固造成的,而在高速滑动时,材料的熔化是摩擦力降低的主要原因。随着滑动速度的增大,平均摩擦力先升高后降低,而基体的平均温度随滑动速度的增大而升高。增大压头的半径使基体温度有很大的提升,但压头半径对摩擦力的提升效应与高温对摩擦力的降低作用相互耦合,使得摩擦力仅呈现出较小程度的提高。

关键词:分子动力学;摩擦性能;热特性;纳观滑动接触

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