| 引用本文: | 张建华,袁方,张金松.非导电胶膜互连的液晶显示屏翘曲模拟[J].材料科学与工艺,2010,18(6):857-861.DOI:10.11951/j.issn.1005-0299.20100625. |
| ZHANG Jian-hua,YUAN Fang,ZHANG Jin-song.Warpage simulation for LCD interconnected by NCF[J].Materials Science and Technology,2010,18(6):857-861.DOI:10.11951/j.issn.1005-0299.20100625. |
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| 摘要: |
| 为研究非导电胶膜封装的液晶显示屏可靠性,用有限元法分析玻璃覆晶模块的温度及应力场.建立玻璃覆晶模块的三维模型,应用热-力耦合分析的顺序耦合法求解热压键合、卸载冷却过程中的模块翘曲和热应力分布.结果表明,热压键合是近稳态的热过程,凸点附近的玻璃基板和芯片温度一致,非导电胶膜在固化过程中吸收热应力、松弛热应变,玻璃覆晶模块的内部温差小、翘曲量小;卸载冷却是非稳态的热过程,模块中各点的温度相差较大,但随时间而逐渐下降并趋于一致,玻璃覆晶模块的内部温差大、热应力大、翘曲量大.减小热压键合过程中的机械载荷和卸载冷却过程中模块的温差,有利于降低液晶显示屏内部的残余热应力及翘曲. |
| 关键词: 非导电胶 玻璃覆晶 翘曲 热应力 数值模拟 |
| DOI：10.11951/j.issn.1005-0299.20100625 |
| 分类号:TB383.2 |
| 基金项目:国家自然科学基金资助项目(50675130);教育部新世纪优秀人才计划资助项目(NCET070535) |
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| Warpage simulation for LCD interconnected by NCF |
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ZHANG Jian-hua1,2, YUAN Fang2, ZHANG Jin-song2
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1.Key Laboratory of Advanced Display and System Applications of Ministry of Education,Shanghai University,Shanghai 200072,China;2.Collge of Mechatronics Engineering and Automation,Shanghai University,Shanghai 200072,China
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| Abstract: |
| To study the reliability of the Chip-on-Glass(COG) module interconnected by Non-Conductive-Adhesive(NCF),this paper applied finite element method(FEM) to simulate the fields of temperature and stress in COG.A 3D model of the COG module had been established and a sequence coupled field had been done to calculate the warpage and inner stress.In the thermalcompression bonding stage,the thermal process was a steady state,which produced a low temperature difference in the COG module,while the NCF absorbed and relaxed the thermal stress and strain to weaken warpage.In the cooling stage,the process was non-steady and a significant temperature difference between the interfaces of bump/NCF and NCF/substrate was induced at the beginning.This generated a high thermal stress difference to yield a large warpage.The residual stress and warpage were proportional to the decrease of the mechanical loading in the thermal compression bonding stage and the temperature difference in the cooling stage. |
| Key words: non-conductive-adhesive chip-on-glass warpage thermal stress simulation |
