| 引用本文: | 孟宪林,胡锐,唐斌,王川云,寇宏超,李金山.中间层对Ni-Cr-W高温合金扩散连接界面组织的影响[J].材料科学与工艺,2013,21(3):41-48.DOI:10.11951/j.issn.1005-0299.20130307. |
| MENG Xian-lin,HU Rui,TANG Bin,WANG Chuan-yun,KOU Hong-chao,LI Jin-shan
.Influence of interlayer on interfacial microstructure of diffusion bonded Ni-Cr-W superalloy[J].Materials Science and Technology,2013,21(3):41-48.DOI:10.11951/j.issn.1005-0299.20130307. |
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| 摘要: |
| 为研究新型Ni-Cr-W合金的扩散连接界面组织特征,采用Cu、Ni、Cu/Ni/Cu箔作中间层,在950 ℃、30 MPa、45 min条件下利用真空扩散连接技术对此合金进行了焊接,并与直接扩散连接形成对比,分析了不同中间层材料对新型Ni基合金扩散连接界面显微组织及元素扩散浓度分布的影响.结果表明:直接扩散连接接头处存在明显的孔洞及二次碳化物M23C6,阻碍了元素的充分扩散,连接界面质量较差；采用Cu箔中间层时,界面连接良好且形成了厚度为1.3 μm的反应层；以Ni箔作中间层时,扩散界面连接良好但无明显反应层存在；而以Cu/Ni/Cu作中间层时,Ni-Cr-W /Cu界面上有较薄反应层生成,Cu/Ni界面则形成厚度达9 μm的无限固溶体层,对比分析表明,高温合金晶界处M23C6的大量析出严重阻碍了Cu原子的扩散. |
| 关键词: 扩散连接 Ni-Cr-W合金 中间层 界面 显微组织 M23C6 |
| DOI：10.11951/j.issn.1005-0299.20130307 |
| 分类号: |
| 基金项目:国家自然科学基金资助项目（51171150）；凝固技术国家重点实验室开放基金资助项目（62-TP-2011). |
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| Influence of interlayer on interfacial microstructure of diffusion bonded Ni-Cr-W superalloy |
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MENG Xian-lin, HU Rui, TANG Bin, WANG Chuan-yun, KOU Hong-chao, LI Jin-shan
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(State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi′an 710072, China)
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| Abstract: |
| To research the microstructural characterization of diffusion-bonded new Ni-Cr-W alloy interfaces, taking Cu, Ni, Cu/Ni/Cu foil as interlayer or without interlayer, the vacuum solid-state diffusion bonding processes were successfully carried out to join Ni-Cr-W alloy at 950 ℃, 30 MPa, 45 min. The influences of different interlayer on the microstructure and elements concentration distribution of new Ni-based alloy across the interface were investigated in details. Results show that several pores and M23C6 particles could be found in the joint of direct diffusion bonding. These defects and precipitates slowed down the diffusion of elements, leading to poor bonding quality. Using Cu foil interlayer, a reaction layers with thickness of 1.3 μm was formed between the Cu and Ni-Cr-W alloy. However, a sound bounding was obtained without any reaction layer when the Ni was used as interlayer. When used Cu/Ni/Cu multilayers, reaction layer and solution layer (thickness is about 9 μm) could be found in Ni-Cr-W/Cu and Ni/Cu interface, respectively. Further investigation indicates that the existence of M23C6 blocked the diffusion of Cu atoms across the diffusion interface. |
| Key words: diffusion bonding Ni-Cr-W alloy interlayer interface microstructure M23C6 |
