| 引用本文: | 鲍 诺,王春洁,宋顺广.不同填胶方式对细间距器件焊点可靠性影响[J].材料科学与工艺,2013,21(3):110-115.DOI:10.11951/j.issn.1005-0299.20130317. |
| BAO Nuo,WANG Chun-jie,SONG Shun-guang.Effects of different ways of filling adhesive on reliability of fine pitch device soldered joints[J].Materials Science and Technology,2013,21(3):110-115.DOI:10.11951/j.issn.1005-0299.20130317. |
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| 摘要: |
| 为了获得一种较好的填胶方式来增加3D PLUS组件焊点的可靠性,采用非线性有限元分析方法和统一型粘塑性Anand本构方程,分析热循环载荷下无胶、端封、底封三种状况焊点的应力、应变分布情况及危险点位置,得到焊点应力和塑性应变周期性累积叠加并逐渐趋于平缓的规律.比较三种状态下焊点的应力、塑性应变的最大值及其变化规律,分析结果表明底封方式能有效的改善焊点的应力、应变状况.改变底封方式胶粘剂的线膨胀系数,找到线膨胀系数对焊点应力、应变影响规律,选出较优线膨胀系数的胶粘剂. |
| 关键词: 焊点 Anand模型 填胶方式 等效应力 塑性应变 有限元法 |
| DOI：10.11951/j.issn.1005-0299.20130317 |
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| Effects of different ways of filling adhesive on reliability of fine pitch device soldered joints |
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BAO Nuo1,2,WANG Chun-jie1,2,SONG Shun-guang1,2
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(1.State Key Laboratory of Virtual Reality Technology and Systems, Beihang University, Beijing 100191, China;2. School of Mechanical Engineering and Automation,Beihang University, Beijing 100191, China;)
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| Abstract: |
| In order to obtain a better way of filling adhesive to enhance the reliability of 3D PLUS solder joints, two schemes under-filled adhesive and side-filled adhesive are designed to compare with the non-adhesive scheme. Stress and strain distribution and dangerous positions of solders of the 3 schemes are analyzed under the thermal cycling condition, using nonlinear FEM and viscoplastic Anand model. The results reveal that the stress and plastic strain of solder joints show significant cyclical changes. The trend of stress and strain accumulated enhancement with the process of time, then ultimately stabilized. Comparison of three curves of equivalent stress and plastic strain show that under-filled adhesive can effectively improve the properties of solder joint stress-strain. The influence of the linear expansion coefficient of adhesive on the stress and strain is also studied based on under-filled adhesive. Suitable adhesive is then obtained though analyzing the optimum stress and strain properties. |
| Key words: Soldered Joint Anand model Filling way Equivalent Stress Equivalent Plastic Strain Finite element method |
