| 引用本文: | 宋贵宏,张晶晶,杨肖平,李锋,陈立佳,贺春林.Cu含量对TiN-Cu纳米复合膜结构与性能的影响[J].材料科学与工艺,2015,23(1):63-68.DOI:10.11951/j.issn.1005-0299.20150111. |
| SONG Guihong,ZHANG Jingjing,YANG Xiaoping,LI Feng,CHEN Lijia,HE Chunlin.Influence of Cu content on structure and properties of TiN-Cu nanocomposite films[J].Materials Science and Technology,2015,23(1):63-68.DOI:10.11951/j.issn.1005-0299.20150111. |
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| 摘要: |
| 为研究纳米复合膜超硬机理和促进其商业应用,利用电弧离子镀制备了TiN-Cu纳米复合膜,并对其表面形貌、晶体结构、能谱、XPS谱和硬度进行研究.结果表明:沉积膜仅含有TiN相和少量的Ti相,TiN相晶粒尺寸随薄膜Cu含量的增加而逐渐减小；尽管有的沉积膜中Cu原子数分数高达8.99%,但仍没有发现金属Cu相或Cu的化合物相衍射峰；沉积膜中Cu元素以金属Cu的状态存在,Ti主要以TiN相存在,少量以金属Ti相存在,但没有Ti2N相；薄膜生长过程中,Cu、Ti和N共沉积,竞争生长,Cu的加入抑制了TiN晶粒的长大；沉积膜的硬度随Cu含量增加而增加,达到最大值后下降,薄膜硬度随Cu含量变化与薄膜中TiN相或Cu相尺寸有关. |
| 关键词: TiN-Cu薄膜 纳米复合膜 硬度 XPS谱 Cu含量 电弧离子镀 |
| DOI：10.11951/j.issn.1005-0299.20150111 |
| 分类号:TG174；TG146.2 |
| 基金项目:国家自然科学基金资助项目(51171118)；沈阳大学辽宁省先进材料制备技术重点实验室资助项目(2012-4). |
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| Influence of Cu content on structure and properties of TiN-Cu nanocomposite films |
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SONG Guihong1, ZHANG Jingjing1, YANG Xiaoping1, LI Feng1, CHEN Lijia1, HE Chunlin2
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(1.School of Material Science and Engineering, Shenyang University of Technology, Shenyang 110870,China;2.Liaoning Provincial Key Laboratory of Advanced Materials(Shenyang University), Shenyang 110044, China)
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| Abstract: |
| To study the super-hard mechanism of nanocomposite film and stimulate its commercial application, the TiN-Cu nanocomposite films were prepared by arc ion plating and the surface morphology, structure, energy spectra, XPS spectra and hardness were investigated. The results show that the TiN and slight metal Ti phase exist in the deposited films. The grain size of TiN phase reduces with the increasing of Cu content in the films. The diffraction peaks of Cu phase or Cu compound phase are still not found even if the Cu content reaches 8.99 at.% in some films. The Cu exists as metal state in the deposited films. The Ti mainly exists in the form of TiN structure and a few Ti exists as metal state without Ti2N structure in the deposited films. During film growth, the Cu, Ti and N co-deposits and competitively grows. The TiN grain growth is prohibited by adding Cu element in the deposited films. The hardness greatly increases first, reaches a maximum value and then decreases with the increasing of Cu content. The hardness variation with Cu content is related to the size of TiN grain or metal Cu phase in the deposited films. |
| Key words: TiN-Cu film nanocomposite film hardness XPS spectra Cu content arc ion plating |
