| 引用本文: | 赵红娟,阎峰云,刘兴丹,陈体军,马郁柏.SiCp/Al复合材料表面电镀Ni-P合金的工艺研究[J].材料科学与工艺,2017,25(1):35-43.DOI:10.11951/j.issn.1005-0299.20160030. |
| ZHAO Hongjuan,YAN Fengyun,LIU Xingdan,CHEN Tijun,MA Yubai.Study on the process of electro-depositing Ni-P coatings on the surface of SiCp/Al composites[J].Materials Science and Technology,2017,25(1):35-43.DOI:10.11951/j.issn.1005-0299.20160030. |
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| SiCp/Al复合材料表面电镀Ni-P合金的工艺研究 |
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赵红娟1,阎峰云1,2,刘兴丹1,陈体军1,2,马郁柏1
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(1.省部共建有色金属先进加工与再利用国家重点实验室(兰州理工大学),兰州 730050;2.有色金属合金 及加工教育部重点实验室(兰州理工大学),兰州 730050)
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| 摘要: |
| 在高体积分数SiCp/Al复合材料表面镀覆一层Ni-P合金可有效改善其可焊性.为在体积分数60%的SiCp/Al复合材料表面电镀一层Ni-P合金，采用正交试验对电镀工艺参数进行了优化，研究了电镀前预处理工艺，并考察了预处理对电镀层的影响.由正交试验获得了最佳硬度和最佳表面质量的工艺参数；采用SEM、EDS、X射线衍射仪和显微硬度计等对镀层进行表征.研究结果表明：P含量通过影响Ni-P的晶体结构，进而影响其性能，随着P含量(9.38 %～15.4%)的增加，Ni-P的非晶态结构越明显，硬度在P含量11.4%时达到最大值723.3 HV；与SiCp/Al表面SiC相上的沉积相比，电沉积Ni-P在Al相上的初始沉积迅速，且长大速度快，导致镀层微观表面凹凸不平.经165 ℃活化热处理及化学镀18 min后，再电镀40 min，获得的镀层微观表面平整、厚12.90～14.79 μm.说明经过优化工艺参数和预处理，可制备表面平整且结合良好的Ni-P电镀层.
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| 关键词: SiCp/Al复合材料 电镀 正交试验 Ni-P镀层 预处理 |
| DOI：10.11951/j.issn.1005-0299.20160030 |
| 分类号:TQ153.2 |
| 文献标识码:A |
| 基金项目:国家自然科学基金资助项目(5,0)；甘肃省重大科技专项资助项目(ZX1406). |
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| Study on the process of electro-depositing Ni-P coatings on the surface of SiCp/Al composites |
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ZHAO Hongjuan1,YAN Fengyun1,2, LIU Xingdan1,CHEN Tijun1,2,MA Yubai1
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(1.Laboratory of Advanced Processing and Recycling of Non-ferrous Metals(Lanzhou University of Technology), Lanzhou 730050, China; 2.Laboratory of Non-Ferrous Metal Alloys and Processing(Lanzhou University of Technology), Ministry of Education, Lanzhou 730050,China)
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| Abstract: |
| The weldability of high volume fraction SiCp/Al composites could be effectively improved by plating Ni-P coatings. In order to electro-deposite nickel-phosphorous (Ni-P) coatings on the surface of SiCp/Al composites reinforced by 60% volume fraction SiC particles, orthogonal tests were conducted to obtain optimal processing parameters and the pretreatment technology was studied. The influences of pretreatment on Ni-P deposits were investigated. SEM, EDS, X-ray diffraction and micro-hardness tester were applied to analyze Ni-P coatings. Optimal processing parameters for preparing Ni-P coatings with the highest hardness or the best surface quality were obtained. The results show that crystallographic structure of Ni-P coatings is mainly influenced by P content, which affects the property of Ni-P alloys. The amorphous state of Ni-P alloys becomes more obvious with P content increased (from 9.38wt% to 15.4wt%), and the P content for getting the maximum of micro-hardness (723.3 HV) is 11.4wt%. The initial deposition of Ni-P alloys and growth of deposits on the surface of Al is much more rapidly than that on the surface of SiC. This huge difference leads to an uneven micro-topography surface of Ni-P coatings on the surface of SiCp/Al. The level surface of Ni-P alloys can be got by
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| Key words: SiCp/Al composite materials electroplating orthogonal tests Ni-P coatings pretreatment |
