| 引用本文: | 王尚,田艳红.微纳连接技术研究进展[J].材料科学与工艺,2017,25(5):1-5.DOI:10.11951/j.issn.1005-0299.20160464. |
| WANG Shang,TIAN Yanhong.The state of art on the micro-joining and nano-joining technologies[J].Materials Science and Technology,2017,25(5):1-5.DOI:10.11951/j.issn.1005-0299.20160464. |
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| 摘要: |
| 近年来，集成电路不断向短小轻薄的高集成方向发展，推动着器件封装尺寸不断缩小，也使器件封装结构发生着改变.同时，作为信息革命的重要组成部分，集成电路技术往往涉及到多个领域的交叉和相互渗透，如微机电系统、精密仪表以及柔性器件等, 而作为电子元器件封装中的关键技术，微纳连接技术的发展直接关系到电子工业中新型封装结构的研发与技术革新.因此，集成电路中微纳连接技术的发展也与多个技术领域密切相关.本文针对电子组装中微连接技术进行归纳和总结，并阐述纳米连接技术所取得的最新研究进展.通过总结微纳连接技术在不同互联尺度下的研究与应用现状，明确了微纳连接技术在电子工业领域中的重要作用，也为目前和未来的相关研究工作提供参考方向.
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| 关键词: 电子封装 微连接 纳连接 电子元器件 软钎焊 |
| DOI：10.11951/j.issn.1005-0299.20160464 |
| 分类号:TG425.1 |
| 文献标识码:A |
| 基金项目:国家优秀青年基金项目(51522503). |
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| The state of art on the micro-joining and nano-joining technologies |
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WANG Shang,TIAN Yanhong
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(State Key Laboratory of Advanced Welding and Joining(Harbin Institute of Technology), Harbin 150001, China)
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| Abstract: |
| In recent years, integrated circuit (IC) is developing towards high integration level, leading to the continuing miniaturization of electronic packages and the change of packages′ structure. Meanwhile, the IC technology, as an important part of information revolution, always connects and interactives with various fields, such as Micro-Electro-Mechanical System (MEMS), Precision Instrument and Machinery, and Flexible Devices. As a key technology of electronic packages, the development of nano-and micro-joining technology is directly related to R & D and technological innovation of new generation of package structures in electronic industry. Hence, the development of nano-and micro-joining technology has a strong relationship with multiple fields. In this paper, the progress of 3D electronics fabrication and nano-joining technology is summarized. Through summarizing the research and application status of micro-joining and nano-joining under different scales, the significance of micro-joining and nano-joining technology in electronic industry is clarified. Moreover, the outline of the present and future research directions is provided.
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| Key words: electronic package nano-joining micro-joining electronic component soldering |
