引用本文: | 李玉龙,董阳平,付艳恕,李学文.T2纯铜/2024铝合金爆炸焊接接头界面结构及性能[J].材料科学与工艺,2019,27(1):47-52.DOI:10.11951/j.issn.1005-0299.20170295. |
| LI Yulong,DONG Yangping,FU Yanshu,LI Xuewen.Interfacial structure and mechanical properties of the explosive welded T2 copper/2024 aluminium alloy joint[J].Materials Science and Technology,2019,27(1):47-52.DOI:10.11951/j.issn.1005-0299.20170295. |
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摘要: |
为研究铜铝异种金属爆炸焊接头界面形成机理,采用爆炸焊对T2纯铜和2024铝合金进行了焊接.通过光学显微镜、扫描电镜、X射线衍射、万能材料试验机和纳米压痕仪, 对T2/2024复合板结合界面的显微组织、成分分布和力学性能进行了测试分析.结果表明:T2/2024合金爆炸复合板结合界面呈波状结合,结合界面主要由平直界面、波状界面和局部熔化层界面构成;靠近结合界面处,基体金属发生塑性变形,晶粒细化;反应层主要成分为AlCu和Al2Cu的混合物.复合板拉剪试验表明,T2/2024合金爆炸复合板平均结合强度为67 MPa,纳米压痕测试反应层平均硬度可达8 GPa. |
关键词: 爆炸焊 铜铝复合结构 结合界面 结合强度 纳米压痕 |
DOI:10.11951/j.issn.1005-0299.20170295 |
分类号:TG456.6 |
文献标识码:A |
基金项目:江西省自然科学基金资助项目(20171BAB206036);南昌大学研究生创新基金资助项目(cx2016085). |
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Interfacial structure and mechanical properties of the explosive welded T2 copper/2024 aluminium alloy joint |
LI Yulong, DONG Yangping, FU Yanshu, LI Xuewen
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(Key Lab for Robot & Welding Automation of Jiangxi Province, Mechanical & Electrical Engineering School, Nanchang University, Nanchang 330031, China)
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Abstract: |
In order to study the formation mechanism of copper and aluminum dissimilar metal explosive welding joint interface, T2 pure copper and 2024 aluminium alloy were explosively welded. The microstructures, composition, and mechanical properties of welded T2/2024 plate were analyzed by optical microscope, scanning electron microscope (SEM), X-ray diffraction, universal material testing machine, and nanoindentation instrument. Results show that the interface of T2/2024 is composed of flat interface, wavy interface, and local melting interface. Close to the bonding interface, base metal plastic deformation occurred, inducing grain refinement. The main component of the reaction layer is a mixture of AlCu and Al2Cu. The average binding strength of T2/2024 alloy explosive composite plate was 67 MPa. The average hardness of the reaction layer was 8 GPa. |
Key words: explosive welding copper-aluminium composite structure bonding interface binding strength nanoindentation |