| 引用本文: | 朱文嘉,徐凤仙,唐丽,张欣,秦俊虎,卢红波,王成亮.In含量对SnBi36Ag0.5无铅焊料合金性能的影响[J].材料科学与工艺,2022,30(1):76-82.DOI:10.11951/j.issn.1005-0299.20210133. |
| ZHU Wenjia,XU Fengxian,TANG Li,ZHANG Xin,QIN Junhu,LU Hongbo,WANG Chengliang.Effect of In content on properties of SnBi36Ag0.5 lead-free solder alloy[J].Materials Science and Technology,2022,30(1):76-82.DOI:10.11951/j.issn.1005-0299.20210133. |
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| In含量对SnBi36Ag0.5无铅焊料合金性能的影响 |
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朱文嘉1,徐凤仙2,唐丽1,张欣1,秦俊虎1,卢红波1,王成亮1
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(1.云南锡业锡材有限公司,昆明 650501; 2.昆明理工大学 材料科学与工程学院,昆明 650093)
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| 摘要: |
| 为了研究In的添加对合金显微组织、熔化特性、润湿性和力学性能的影响。按质量比将纯锡、铋锭、银锭和铟锭在400 ℃熔化,保温6 h,搅拌均匀后在320 ℃浇铸,制备成SnBi36Ag0.5Inx(x=0%、0.1%、0.2%、0.3%、0.4%、0.5%)焊料合金。利用X射线衍射仪、光学金相显微镜(OM)、扫描电镜能谱(SEM-EDS)、差示扫描量热分析仪(DSC)、 可焊性测试仪及万能材料试验机对合金的物相、显微组织、相成分、熔化特性、润湿性及力学性能进行表征。结果表明:SnBi36Ag0.5Inx焊料合金显微组织为Sn相、Bi相和Ag3Sn相,In的添加能够抑制Bi的偏析,使粗大Bi相的面积和数量减少。微量In的添加不会形成化合物,而是以固溶的方式存在于Sn基体中。In会略微减小固相线温度,增大液相线温度使熔程增大。添加In后润湿时间变长,润湿力随着In含量的升高有明显提升。In含量为0.5%时合金有最高的延伸率。 |
| 关键词: SnBi36Ag0.5 熔点 润湿性 显微组织 力学性能 |
| DOI：10.11951/j.issn.1005-0299.20210133 |
| 分类号:TG425 |
| 文献标识码:A |
| 基金项目:云南省重大科技专项(2018ZE004). |
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| Effect of In content on properties of SnBi36Ag0.5 lead-free solder alloy |
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ZHU Wenjia1, XU Fengxian2, TANG Li1, ZHANG Xin1, QIN Junhu1, LU Hongbo1, WANG Chengliang1
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(1.Yunnan Tin Products Manufacturing Co., Ltd., Kunming 650501, China; 2.Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China)
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| Abstract: |
| The effects of In content on the microstructure, melting properties, wettability, and mechanical properties of solder alloys were investigated. According to mass ratio, pure tin, bismuth ingot, silver ingot, and indium ingot were melted at 400 ℃ and held for 6 h, which were then evenly stirred and casted at 320 ℃ to prepare SnBi36Ag0.5Inx(x=0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%) solder alloys. The phase, microstructure, phase composition, melting properties, wettability, and mechanical properties of the alloy were characterized by X-ray diffractometer, optical metallography microscope (OM), scanning electron microscopy and energy dispersive spectrum (SEM-EDS), differential scanning calorimeter (DSC), weldability tester, and universal material tester. Results show that the microstructure of SnBi36Ag0.5Inx solder alloy included Sn phase, Bi phase, and Ag3Sn phase. The addition of In content could inhibit the segregation of Bi and reduce the area and number of thick Bi phase. The addition of trace In content did not form compounds, but it existed in the Sn matrix as solid solution. In content could slightly decrease the solid line temperature and increase the liquidus temperature to increase the melt path. The wetting time became longer after the addition of In, and the wetting force increased significantly with the increase of In content. The alloy with 0.5% In content had the highest elongation. |
| Key words: SnBi36Ag0.5 melting point wettability microstructure mechanical properties |
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