| 引用本文: | 张建,罗国强,李美娟,王仪宇,沈强,张联盟.钼铜扩散焊接接头界面显微组织[J].材料科学与工艺,2012,20(4):61-64.DOI:10.11951/j.issn.1005-0299.20120411. |
| ZHANG Jian,LUO Guo-qiang,LI Mei-juan,WANG Yi-yu,SHEN Qiang,ZHANG Lian-meng.Microstructure in interface zone of diffusion welded joint of Mo and Cu[J].Materials Science and Technology,2012,20(4):61-64.DOI:10.11951/j.issn.1005-0299.20120411. |
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| 摘要: |
| 采用扩散焊接方法对钼铜异种材料进行了焊接,研究了直接焊接和加镍作为中间层焊接对焊接接头界面显微组织的影响,通过SEM、EDS、EPMA、XRD等测试方法对其显微结构进行了表征.结果表明,直接焊接时,焊接界面结合紧密,Mo、Cu原子之间相互扩散形成扩散层,接头断裂发生在扩散层,由于柯肯达尔效应作用,在铜侧形成少量孔洞,孔洞的存在使焊接接头性能降低；加镍中间层焊接时,接头抗拉强度高于直接焊接时抗拉强度,Mo/Ni和Ni/Cu界面结合紧密,Mo/Ni界面形成固溶体层,接头断裂发生在Mo/Ni界面处,断口呈典型的脆性断裂特征. |
| 关键词: 扩散焊接 钼与铜 显微组织 Ni中间层 |
| DOI：10.11951/j.issn.1005-0299.20120411 |
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| 基金项目:国家自然科学基金资助项目(11072228);中央高校基本科研业务费专项资金资助项目(2011-IV-038 ). |
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| Microstructure in interface zone of diffusion welded joint of Mo and Cu |
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ZHANG Jian, LUO Guo-qiang, LI Mei-juan, WANG Yi-yu, SHEN Qiang, ZHANG Lian-meng
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State Key Laboratory of Advanced Technology for Materials Synthesis and Processing,Wuhan University of Technology, Wuhan 430070,China
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| Abstract: |
| In this paper,Mo and Cu were welded together by diffusion welding with or without a Ni interlayer.SEM,EDS,EPMA,XRD were used to characterize the structure and the element distribution of the interface zone.The results showed that the Mo/Cu joint combined homogeneously by diffusion welding,the diffusion layer formed at the interface due to Mo atoms and Cu atoms inter-diffusion.There were some micro-voids on the copper side of the joint due to the role of kirkendall effect,and the voids reduced the performance of the joint.For the Mo/Ni/Cu joint,Mo/Ni and Ni/Cu interface were linked together,and the tensile strength of the Mo/Ni/Cu joint was higher than the Mo/Cu joint,because the added nickel eased the thermal stress of the joint.A solid solution was formed at the Mo/Ni interface where a joint brittle fracture took place. |
| Key words: diffusion welding Mo and Cu microstructure Ni interlayer |
