| 引用本文: | 刘蛟蛟,韩钰,祝志祥,陈保安,张宏宇,李红英.均匀化退火后冷却条件对Al-Cu合金组织性能影响[J].材料科学与工艺,2016,24(4):52-58.DOI:10.11951/j.issn.1005-0299.20160408. |
| LIU Jiaojiao,HAN Yu,ZHU Zhixiang,CHEN Baoan,ZHANG Hongyu,LI Hongying.Effect of cooling conditions after homogenization on the microstructure and performance of an Al-Cu alloy[J].Materials Science and Technology,2016,24(4):52-58.DOI:10.11951/j.issn.1005-0299.20160408. |
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| 均匀化退火后冷却条件对Al-Cu合金组织性能影响 |
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刘蛟蛟1,2,韩钰3,祝志祥3,陈保安3,张宏宇4,李红英2
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(1.国网湖南省电力有限公司 电力科学研究院,长沙 411107;2.中南大学 材料科学与工程学院,长沙410083; 3.国网智能电网研究院 电工新材料及微电子研究所,北京 102211;4.国网辽宁省电力有限公司,沈阳 110006)
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| 摘要: |
| 为优化铝合金均匀化退火后的冷却工艺参数，采用动态电阻法、扫描电镜、透射电镜观察、能谱分析和硬度测试等方法，研究了均匀化处理后的冷却条件对Al-4%Cu合金组织性能的影响.获得的电阻率-温度曲线与材料的脱溶行为有良好的相关性.随着均匀化处理后冷却速率的降低，实验合金在冷却过程中会依次析出平衡相θ、亚稳相θ′和θ″.绘制了实验合金的CCT图，确定的脱溶敏感温度区间为500~300 ℃.选用合适的冷却工艺可以改善合金的组织性能，冷却时间超过1 000 min，合金有较低的硬度和电阻率.当实验合金均匀化后冷却至室温的时间处于19.4~184.1 min时会析出θ″相，导致硬度和电阻率上升，不利于后续的塑性加工，应该尽量避免.
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| 关键词: Al-Cu合金 冷却条件 电阻率 硬度 微观组织 |
| DOI：10.11951/j.issn.1005-0299.20160408 |
| 分类号:TG146.2 |
| 文献标识码:A |
| 基金项目:国家电网公司科技项目(SGRI-WD-71-13-001). |
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| Effect of cooling conditions after homogenization on the microstructure and performance of an Al-Cu alloy |
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LIU Jiaojiao1,2,HAN Yu3, ZHU Zhixiang3, CHEN Baoan3, ZHANG Hongyu4, LI Hongying2
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(1.State Crid Huna Electrical Power Company Research Institute, Changsha 411107, China;2.School of Materials Science and Engineering, Central South University, Changsha 410083, China; 3.Dept. of Electrical Engineering New Materials & Microelectronics,State Grid Smart Grid Research Institute, Beijing 102211, China; 4.State Grid Liaoning Electrical Power Company, Shenyang 110006, China)
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| Abstract: |
| In order to optimize the cooling parameters after homogenization, the microstructure and properties evolutions during the cooling processes have been investigated by in-situ electrical resistivity measurements, scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive spectrometer (EDS) and hardness test. The result has shown that the electrical resistivity curves have a good agreement with the precipitation behaviors. There were three types of precipitates in the studied alloy under different cooling conditions. And the precipitation sequence was equilibrium θ phase, metastable θ′ phase and θ″ phase. The hardness-time and resistivity-time curves revealed that choosing a suitable cooling condition could improve the microstructures and performance of the alloy. The optimal cooling time was exceeding 1 000 min, so that the hardness and resistivity of the alloy was located in a low level. However, the cooling should avoid being finished in the 19.4~184.1 min. The precipitation of θ″ phase in this range would lead to the increasing of hardness and resistivity, which was harmful to the subsequent plastic working.
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| Key words: Al-Cu alloy cooling process electrical resistivity hardness microstructure |
