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主管单位 中华人民共和国
工业和信息化部
主办单位 中国材料研究学会
哈尔滨工业大学
主编 苑世剑 国际刊号ISSN 1005-0299 国内刊号CN 23-1345/TB

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引用本文:郑苗,刘薇,王晓蓉,陈融,王天根,沈杭燕.机械合金化法制备Ag-Cu基中温合金钎料工艺研究[J].材料科学与工艺,2016,24(6):20-26.DOI:10.11951/j.issn.1005-0299.20160604.
ZHENG Miao,LIU Wei,WANG Xiaorong,CHEN Rong,WANG Tiangen,SHEN Hangyan.Technical study on Ag-Cu based medium temperature solder prepared by mechanical alloying method[J].Materials Science and Technology,2016,24(6):20-26.DOI:10.11951/j.issn.1005-0299.20160604.
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机械合金化法制备Ag-Cu基中温合金钎料工艺研究
郑苗1,刘薇1,王晓蓉2,陈融2,王天根1,沈杭燕1
(1.中国计量大学 材料科学与工程学院,杭州310018;2.杭州华光焊接新材料股份有限公司,杭州311112)
摘要:
为研究机械合金化法制备Ag-Cu中温合金钎料的工艺过程,系统分析了球磨工艺参数对合金焊粉粒度及形貌演变的影响,确定了机械合金化制备球磨焊粉的优化工艺参数.采用X射线衍射仪(XRD)、扫描电镜(SEM)和差示扫描量热分析仪(DSC)等分析手段,对合金化过程中物相变化、微观结构及熔化特性进行了表征,并在此基础上进行了Ag-Cu基三元和四元焊粉机械合金化的研究.结果表明:Ag-Cu系合金焊粉经优化工艺(球料比20:1, 转速400 r/min,无水乙醇作为工艺控制剂, 球磨40 h)球磨后, 合金化完全,以过饱和固溶体为基体相;不同组元的添加对于焊粉尺寸形貌和相结构的影响不同.Ag-Cu-10Sn粉末在球磨40 h后生成了以亚稳态的过饱和固溶体Ag (Cu)为主要组成相的合金粉,其金相组织细小均匀,与不锈钢基板之间形成过渡层,有利于增加接头强度.这表明,通过控制球磨工艺和多组元的添加,可改变合金粉末的形貌和相结构,能得到过饱和固溶体为主要组成相的钎料合金,有利于改善钎料的性能.
关键词:  中温钎料  机械合金化  Ag-Cu基钎料  金属间化合物  过饱和固溶体
DOI:10.11951/j.issn.1005-0299.20160604
分类号:TG425
文献标识码:A
基金项目:
Technical study on Ag-Cu based medium temperature solder prepared by mechanical alloying method
ZHENG Miao1,LIU Wei1,WANG Xiaorong2,CHEN Rong2,WANG Tiangen1,SHEN Hangyan1
(1.College of Materials Science and Engineering, China Jiliang University, Hangzhou 310018,China; 2.Hangzhou Huaguang Advanced Welding Materials Co., Ltd, Hangzhou 311112,China)
Abstract:
To study the preparation process of the medium temperature solder powders using mechanical alloying method, the effects of ball-milling parameters on the size and morphology evolution of the powders were systematic studied and optimized. The phase compositions, microstructure and melting properties of the powders were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM) and differential scanning calorimetry (DSC) methods. The mechanical alloying of ternary and quaternary solder powders based on Ag-Cu was also carried out. The results show that Ag-Cu system solder powders can be completely alloyed with the optimized ball-milling parameters: 20:1 ball-to-powder weight ratio, 400 r/min milling speed, ethyl alcohol as PCA, milling for 40 h, and the supersaturated solid solutions can be obtained. The different elements additions such as Sn, Zn, Ni have the different influence on the morphology and phase structure of the alloyed powders. Metastable Ag (Cu) supersaturated solid solution matrix was obtained for 40 h-milled AgCu10Sn. The fine microstructure of solder powders as well as the transition layer between brazing metal and stainless steel substrate are beneficial for the enhanced joint strength. It is shown that the powders morphology and phase structure could be modified by fine controlling the milling time and the additions of the multi-elements, which is helpful to form the supersaturated solid solution matrix, and thus to improve the performance of the solder powders.
Key words:  medium temperature solder  mechanical alloy  Ag-Cu brazing alloy  intermetallics  supersaturated solid solution

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