| 引用本文: | 高雅,钟素娟,纠永涛,李胜男.In对AgCuZnNiMn钎料显微组织和流铺性能的影响[J].材料科学与工艺,2018,26(4):52-58.DOI:10.11951/j.issn.1005-0299.20170329. |
| GAO Ya,ZHONG Sujuan,JIU Yongtao,LI Shengnan.Microstructure and wetting property of AgCuZnNiMn filler metals with indium element[J].Materials Science and Technology,2018,26(4):52-58.DOI:10.11951/j.issn.1005-0299.20170329. |
|
| 摘要: |
| AgCuZnNiMn钎料熔点适中、塑性好，常用于高强度、可承受冲击载荷工件的钎焊.为降低钎料熔点，向钎料中加入不同含量的In元素，并分析了In对AgCuZnNiMn钎料显微组织、熔化过程、润湿铺展性能的影响.结果表明：AgCuZnNiMn钎料主要由银基固溶体、富铜相、二者的共晶组织以及γ′(Mn, Ni)相组成；钎料凝固过程中先析出γ′(Mn, Ni)相，In含量达2.0wt.%时，组织中粗大的块状γ′(Mn, Ni)相全部转变为尺寸较小的球形颗粒状；熔体中的γ′(Mn, Ni)相可成为富铜相的形核基底，细小颗粒状γ′(Mn, Ni)相的增多对富铜相的细化具有促进作用；钎料中Zn、Mn元素在富铜相中的固溶度较银基固溶体中大，Ni元素主要分布于富铜相中，In元素分布于银基固溶体中；随In含量的增加，AgCuZnNiMn钎料的固相和液相温度均降低，但固-液温度区间无明显变化；钎料的润湿铺展面积随In含量增加而增大，当In含量为1.5wt.%时铺展面积达到峰值.
|
| 关键词: AgCuZnNiMn钎料 显微组织 元素分布 熔化过程 润湿性 |
| DOI：10.11951/j.issn.1005-0299.20170329 |
| 分类号:TG425.2 |
| 文献标识码:A |
| 基金项目:国家重点研发计划战略性国际科技创新合作计划项目(2016YFE0201300). |
|
| Microstructure and wetting property of AgCuZnNiMn filler metals with indium element |
|
GAO Ya, ZHONG Sujuan, JIU Yongtao, LI Shengnan
|
|
(State Key Laboratory of Advanced Brazing Filler Metals and Technology (Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.), Zhengzhou 450001, China)
|
| Abstract: |
| Due to their excellent plastic property and moderate solidus temperature, AgCuZnNiMn filler metals are widely used to braze high-strength and anti-impact workpieces.in this study, Indium element(In) was added into the filler metals in order to reduce its solidus temperature. The effects of In on the microstructure, element distribution, melting process and wetting performance of AgCuZnNiMn filler metals were analyzed. The results showed that AgCuZnNiMn filler metals were composed of silver-based solid solutions, copper-rich phases, eutectic structure and γ′(Mn, Ni) phases. During the solidification of the filler metal, γ′(Mn, Ni) phases were separated from the melt firstly. When the content of In was 2.0wt.%, coarse γ′(Mn, Ni) phases were transformed into fine phases. Because copper-rich phases could nucleate on the interface of γ′(Mn, Ni) phases, fine γ'(Mn, Ni) phases were of benefit to the refinement of copper-rich phases. The solid solubility of Zn and Mn in the copper-rich phase was larger than that in the silver-based solid solution. Ni mainly spread out in the Cu-rich phase, and In spread out in the silver-based solid solution. With the increase of indium content, the solidus and liquidus temperature decreased but the interval of solid-liquid temperature did not change significantly. The wetting areas of the filler metal increased with the increase of indium content and reached the peak when In content was 1.5 wt.%.
|
| Key words: AgCuZnNiMn filler metals microstructure element distribution melting process wetting property |
