| 引用本文: | 严继康,陈东东,甘有为,甘国友,易健宏.P元素对Sn-0.7Cu焊料合金性能的影响[J].材料科学与工艺,2019,27(5):39-43.DOI:10.11951/j.issn.1005-0299.20180017. |
| YAN Jikang,CHEN Dongdong,GAN Youwei,GAN Guoyou,YI Jianhong.Effect of P on properties of Sn-0.7Cu lead-free solder alloy[J].Materials Science and Technology,2019,27(5):39-43.DOI:10.11951/j.issn.1005-0299.20180017. |
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| P元素对Sn-0.7Cu焊料合金性能的影响 |
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严继康1,陈东东1,2,甘有为1,2,甘国友1,易健宏1
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(1.昆明理工大学 材料科学与工程学院,昆明 650093;2.云南锡业锡材有限公司,昆明 650501)
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| 摘要: |
| 为了研究P元素含量对合金微观组织、熔程、润湿性和抗氧化性能的影响，将纯锡和中间合金Sn-10Cu及Sn-3.5P按质量比在270 ℃熔化，保温20 min后搅拌均匀，浇铸冷却后制备成Sn-0.7Cu-xP(x=0~0.1)焊料合金.通过光学显微镜观察焊料合金的显微组织，分别利用X射线衍射仪(XRD)和差示扫描量热分析仪(DSC)对焊料合金进行了物相分析和熔点测定，采用润湿平衡法测定焊料的润湿性，用静态刮渣法测定焊料的抗氧化性.研究表明：焊料合金晶粒随着P元素含量的升高而增加；焊料合金的熔程随着P元素含量的升高先增加后降低；焊料的润湿时间随着P元素含量的增加先减小后增大，润湿力随着P元素含量的增加而减小，在P含量为0.001%时润湿性较好；P元素含量为0.01%时，Sn-0.7Cu的抗氧化性能较好. |
| 关键词: Sn-0.7Cu P 显微组织 润湿性 抗氧化性能 |
| DOI：10.11951/j.issn.1005-0299.20180017 |
| 分类号:TG425 |
| 文献标识码:A |
| 基金项目:电子贴装用锡焊料系列产品开发项目(2018ZE004). |
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| Effect of P on properties of Sn-0.7Cu lead-free solder alloy |
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YAN Jikang1, CHEN Dongdong1,2,GAN Youwei1,2, GAN Guoyou1, YI Jianhong1
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(1.Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China; 2.Yunnan Tin and Materials Co.,Ltd.,Kunming 650501,China)
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| Abstract: |
| The effects of P content on microstructure, melting range, wettability and oxidation resistance of the solder alloy were investigated. The pure tin and master alloys Sn-10Cu and Sn-3.5P were melted at 270 ℃ according to the mass ratio. After 20 min insulation, the alloys were stirred evenly, and then the Sn-0.7Cu-xP (x=0~0.1) solder alloys were prepared after casting and cooling. The microstructure of the solder alloys were observed by optical microscope, and the phase analysis and the melting point of the solder alloys were analyzed by x-ray diffractometer(XRD) and differential scanning calorimetry(DSC) respectively, and the wettability of the solder on Cu substrate was investigated by wetting balance testing method.The results showed that the grain size of solder alloy increased with the increase of the P content; the melting range of solder alloy firstly increased and then decreased with the increase of the P content; the wetting time of solder alloy firstly decreased and then increased with the increase of P content; the wetting force of solder alloy decreased with the increase of P content; when P content was 0.001%, Sn-0.7Cu had better wettability; and when P content was 0.01%, the oxidation resistance of Sn-0.7Cu was better. |
| Key words: Sn-0.7Cu P microstructure wettability oxidation resistance |
