| 引用本文: | 王庆娟,刘丹,孙亚玲,周海雄,王伟.ECAP变形对超细晶铜再结晶行为的影响[J].材料科学与工艺,2019,27(6):19-26.DOI:10.11951/j.issn.1005-0299.20180218. |
| WANG Qingjuan,LIU Dan,SUN Yaling,ZHOU Haixiong,WANG Wei.Effect of ECAP deformation on the recrystallization behavior of ultra-fine grained copper[J].Materials Science and Technology,2019,27(6):19-26.DOI:10.11951/j.issn.1005-0299.20180218. |
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| 摘要: |
| 为研究ECAP变形对超细晶铜再结晶行为的影响,室温条件下对纯铜进行12道次等通道转角挤压(ECAP)变形,分别在100、150、280 ℃下对不同道次的超细晶铜进行退火处理,分析其硬度及微观组织变化规律.结果表明:经12道次ECAP变形后,铜的晶粒尺寸细化到约250 nm,硬度达146 HV；随着变形道次增加,超细晶铜的热稳定性降低,软化速度加快,在150 ℃退火时,1道次超细晶铜完成再结晶的时间约为20 h,12道次为0.5 h；12道次ECAP超细晶铜等温退火温度越高,完成再结晶时间越短,150 ℃完成再结晶时间约为1 200 s,200 ℃时缩短至600 s,280 ℃时再结晶仅需50 s；利用Arrhenius公式计算了再结晶激活能,1道次约为1 eV,12道次为0.78 eV,ECAP变形降低了铜的再结晶激活能. |
| 关键词: 超细晶铜 ECAP 退火 再结晶 激活能 |
| DOI：10.11951/j.issn.1005-0299.20180218 |
| 分类号:TG146.1 |
| 文献标识码:A |
| 基金项目:国家重点研发计划项目(2017YFB0306200)；西安市科技计划项目(JZKD002).陕西省教育厅2019年度服务地方科学研究计划(19JC025) |
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| Effect of ECAP deformation on the recrystallization behavior of ultra-fine grained copper |
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WANG Qingjuan, LIU Dan, SUN Yaling, ZHOU Haixiong, WANG Wei
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(School of Metallurgy Engineering, Xi′an University of Architecture and Technology, Xi′an 710055, China) [HJ1.75mm]
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| Abstract: |
| To study the effect of equal channel angular compression(ECAP) deformation on the recrystallization behavior of ultra-fine grained copper, 12 times of ECAP deformation were performed on pure copper at room temperature. The ultra-fine grained copper of different passes was annealed at 100, 150, and 280 ℃, and the changes of hardness and microstructure were analyzed. Results show that after 12 times of ECAP deformation, the grain size of the copper was refined to ~250 nm, and the hardness reache 146 HV. With the increase of the deformation pass, the thermal stability of the ultra-fine grain copper decreased, and the softening rate increased. When annealing occurred at 150 ℃, the time required for the recrystallization of the ultra-fine grained copper in one pass was about 20 h, and that for 12 passes was 0.5 h. The higher the isothermal annealing temperature of the 12-pass ECAP ultra-fine crystal copper was, the shorter the recrystallization time was. The recrystallization time was about 1 200 s at 150 ℃, which was shortened to 600 s at 200 ℃, and it only cost 50 s to recrystallize at 280 ℃. The activation energy of recrystallization was calculated by the Arrhenius formula, with 1 pass in 1 eV and 0.78 eV in 12 passes. The ECAP deformation reduced the reactivation activation energy of the copper. |
| Key words: ultra-finegrained copper ECAP anneal recrystallization activation energy |
