| 引用本文: | 吴建辉,吴蒙华,王元刚,贾卫平.无掩模定域性电沉积三维微结构的工艺研究[J].材料科学与工艺,2020,28(6):29-35.DOI:10.11951/j.issn.1005-0299.20190085. |
| WU Jianhui,WU Menghua,WANG Yuangang,JIA Weiping.Process research on additive manufacturing of 3D metallic microstructure by mask-less localized electrodeposition[J].Materials Science and Technology,2020,28(6):29-35.DOI:10.11951/j.issn.1005-0299.20190085. |
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| 摘要: |
| 在无掩模定域性电沉积增材制造三维金属微结构的工艺试验过程中,针对成型质量、速度与可重复性的基本要求,采用控制单一变量法和正交实验法研究了极间电压、脉冲占空比、极间距等主要工艺参数对实验结果的影响。研究结果表明:极间电压的大小对微区域电沉积速率一致性、脉冲电流占空比对微沉积速率大小、极间距大小对微沉积区域电场线分布均有不同程度的影响。通过正交实验优化得到的工艺参数为:极间电压2 V、脉冲电流占空比0.4、极间距20 μm、脉冲频率2 kHz,三坐标工作台X和Y轴移动速度均为1 μm/s、Z轴移动速度5 μm/s。通过优化工艺参数取得较好的沉积效果,沉积速率可达300 μm3/s,获得的镍质简单三维微结构,最大深宽比12∶1。 |
| 关键词: 电镀 无掩模 定域性电沉积 增材制造 三维金属微结构 |
| DOI：10.11951/j.issn.1005-0299.20190085 |
| 分类号:TQ153.4+3 |
| 文献标识码:A |
| 基金项目:国家自然科学基金资助项目(51741501,51875071). |
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| Process research on additive manufacturing of 3D metallic microstructure by mask-less localized electrodeposition |
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WU Jianhui, WU Menghua, WANG Yuangang, JIA Weiping
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(School of Mechanical Engineering, Dalian University, Dalian 116622, China)
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| Abstract: |
| During the additive manufacturing of 3D metallic microstructure by mask-less localized electrodeposition process, the effects of main processing parameters such as interelectrode voltage, pulse duty cycle, and interelectrode gap on experimental results were studied by controlling single variable method and orthogonal experiment method, aiming to meet the basic requirements for molding quality, speed, and repeatability. The results have demonstrated that the magnitude of the interelectrode voltage,the pulse current duty cycle, and the size of the interelectrode gap will affect the consistency of the micro-area electrodeposition rate, the rate of microdeposition, and the electric field line distribution in the micro-deposition area, respectively. An interelectrode voltage of 2 V, a pulse duty cycle of 0.4, an interelectrode gap of 20 μm, a pulse frequency of 2 kHz, the coordinate table X and Y axis movement speeds of 1 μm/s, and Z axis moving speed of 5 μm/s are optimized processing parameters by orthogonal experiments. Using these optimized parameters, the deposition rate can reach 300 μm3/s and the obtained nickel three-dimensional microstructure has a maximum aspect ratio of 12∶1. |
| Key words: electroplate mask-less localized electrodeposition additive manufacturing 3D metallic microstructure |
