引用本文: | 贾贤潇,朱晓云,龙晋明.镀银铝粉的制备及其机理分析[J].材料科学与工艺,2021,29(4):52-57.DOI:10.11951/j.issn.1005-0299.20210015. |
| JIA Xianxiao,ZHU Xiaoyun,LONG Jinming.Preparation and mechanism analysis of silver-plated aluminum powder[J].Materials Science and Technology,2021,29(4):52-57.DOI:10.11951/j.issn.1005-0299.20210015. |
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摘要: |
通过置换反应法制备镀银铝粉时所得到的银层不够致密,为了提升银镀层对铝粉的包覆效果,本文利用扫描电子显微镜、X射线衍射仪观察镀银铝粉的包覆效果和微观结构,并采用电化学工作站对反应过程中铝基体电位的变化进行分析。结果表明,在活化的铝粉表面依靠铝银之间的置换反应可以使银沉积,但由于电化学微电偶电池效应的存在,仅通过置换反应无法得到致密的镀银层。进一步研究发现,通过添加合适的还原剂来降低置换反应中的微电偶电池效应的影响,可以改善银颗粒的沉积形貌并提高镀银层的致密性,从而降低镀银铝粉的压片电阻。 |
关键词: 镀银铝粉 置换反应 微电偶电池效应 还原剂 压片电阻 |
DOI:10.11951/j.issn.1005-0299.20210015 |
分类号:TB34 |
文献标识码:A |
基金项目:昆明理工大学分析测试基金资助项目(2018M20172230072). |
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Preparation and mechanism analysis of silver-plated aluminum powder |
JIA Xianxiao, ZHU Xiaoyun, LONG Jinming
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(Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China)
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Abstract: |
The silver-plated aluminum powder prepared by substitution reaction has a non-compact silver layer. In order to improve the coating effect of silver-plated aluminum powder, SEM and XRD were adopted to observe the coating morphology and the microstructure of silver-plated aluminum powder. The electrochemical workstation was used to analyze the changes in the aluminum substrate potential during the reaction. Results show that the substitution reaction between aluminum and silver on the surface of the activated aluminum powder could deposit silver. However, due to the existence of the electrochemical micro galvanic-couple cell effect, a dense silver coating could not be obtained only by the substitution reaction. Further research found that by adding a suitable reducing agent to reduce the influence of the micro galvanic-couple cell effect in the substitution reaction, the deposition morphology of the silver particles could be changed and the compactness of the silver-plated layer could be increased, thereby reducing the tablet resistance of the silver-plated aluminum powder. |
Key words: silver-plated aluminum powder substitution reaction micro galvanic-couple cell effect reducing agent tablet resistance |