| 引用本文: | 张冠星,龙伟民,沈元勋,张雷,王蒙,董宏伟.梯度三明治银基钎料复合界面组织及生长动力学研究[J].材料科学与工艺,2022,30(3):28-35.DOI:10.11951/j.issn.1005-0299.20210312. |
| ZHANG Guanxing,LONG Weimin,SHEN Yuanxun,ZHANG Lei,WANG Meng,DONG Hongwei.Research on microstructure and growth kinetics of composite interface for gradient sandwich-like silver-based filler metal[J].Materials Science and Technology,2022,30(3):28-35.DOI:10.11951/j.issn.1005-0299.20210312. |
|
| 摘要: |
| 针对梯度钎料轧制过程中易出现撕裂的问题,借助扫描电镜、EDS 能谱仪、万能力学试验机等手段研究气保护热压复合BAg40CuZnNi/CuMn2/BAg40CuZnNiMnCo梯度三明治复合钎料均匀化退火工艺对界面扩散组织和性能的影响规律,探明复合界面生长行为,为优化退火工艺提供技术参考。研究结果表明:热压复合界面扩散层主要为富铜相、富银相；随均匀化退火时间的延长,界面两侧元素不断发生互扩散,界面结合强度有所下降,当保温时间在5 ~18 h时强度稳定在180 MPa左右。继续延长时间,界面扩散层厚度超过20 μm,脆性的AgZn3相尺寸不断粗化增大,强度由初始态的260 MPa下降到100 MPa左右,导致复合钎料在轧制过程中出现开裂。退火不同时间后,界面扩散层厚度逐渐增加,其趋势符合抛物线法则；当退火温度达823 K,保温18 h时,扩散层厚度由原来的12.5 μm增加到22.4 μm；运用Arrhenius方程计算得出界面扩散层生长激活能为20.810 8 kJ/mol,并获得其生长动力学模型,通过此模型可对扩散层厚度进行初步计算。 |
| 关键词: 钎焊材料 梯度三明治 界面扩散 微观组织 生长动力学 |
| DOI：10.11951/j.issn.1005-0299.20210312 |
| 分类号:TG425 |
| 文献标识码:A |
| 基金项目:国家自然科学基金资助项目(U1904197). |
|
| Research on microstructure and growth kinetics of composite interface for gradient sandwich-like silver-based filler metal |
|
ZHANG Guanxing, LONG Weimin, SHEN Yuanxun, ZHANG Lei, WANG Meng, DONG Hongwei
|
|
(Zhengzhou Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou 450001, China)
|
| Abstract: |
| In view of the problem of easy tearing of gradient filler metal during rolling, the effect of homogenizing annealing process on the interface diffusion microstructure and mechanical properties of BAg40CuZnNi/CuMn2/BAg40CuZnNiMnCo gradient sandwich-like composite brazing filler metal prepared by gas protection hot pressing were studied via scanning electron microscope, EDS energy spectrometer, and universal mechanical testing machine to investigate the growth behavior of the composite interface and provide technical reference for the optimization of the annealing process. Results show that the hot pressed composite interface diffusion layer was mainly consisted of copper-rich phase and silver-rich phase. With the increase in the homogenization annealing time, the elements on both sides of the interface diffused continuously, the bonding strength of the interface decreased, and the strength stabilized at about 180 MPa when the holding time was between 5 h and 18 h. When the holding time was extended to 25 h, the thickness of the interface diffusion layer exceeded to 20 μm, and the size of the brittle AgZn3 phase increased continuously. The strength decreased from 260 MPa to 100 MPa, which led to cracking phenomenon in the rolling process. After annealing for different time, the thickness of the interface diffusion layer increased gradually, and the thickening trend conformed to parabolic law. When the annealing temperature reached 823 K and the holding time was 18 h, the thickness of the diffusion layer increased from the original 12.5 μm to 22.4 μm. The activation energy for the growth of the interface diffusion layer was calculated by the Arrhenius equation to be 20.810 8 kJ/mol, and the growth kinetics model was obtained, which could be utilized for the preliminary calculation of the thickness of the diffusion layer. |
| Key words: brazing filler metal gradient sandwich interface diffusion microstructure growth kinetics |
