| 引用本文: | 曹坤,王菁潇,董承卫,石倩,田方华,张垠,杨森,宋晓平.石墨烯基导热薄膜的研究进展[J].材料科学与工艺,2024,32(2):29-43.DOI:10.11951/j.issn.1005-0299.20220449. |
| CAO Kun,WANG Jingxiao,DONG Chengwei,SHI Qian,TIAN Fanghua,ZHANG Yin,YANG Sen,SONG Xiaoping.Research progress of thermally conductive graphene-based films[J].Materials Science and Technology,2024,32(2):29-43.DOI:10.11951/j.issn.1005-0299.20220449. |
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| 石墨烯基导热薄膜的研究进展 |
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曹坤,王菁潇,董承卫,石倩,田方华,张垠,杨森,宋晓平
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(西安交通大学 物理学院,西安 710049)
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| 摘要: |
| 随着现代技术的发展,散热和导热已成为制约芯片器件小型化和大功率制造业发展的关键问题之一。由于传统的金属导热材料存在密度大和易氧化等问题,近年来以石墨烯基材料为代表的非金属碳基材料逐渐成为国内外的研究热点。本文综述了近年国内外石墨烯导热薄膜的制备方法及最新研究成果,分析讨论了热处理工艺、晶粒尺寸、薄膜密度及杂质原子和缺陷等对石墨烯导热薄膜性能的影响和物理机理,并对该领域的发展趋势进行了展望。 |
| 关键词: 还原氧化石墨烯 石墨烯 导热片 缺陷 热导率 |
| DOI：10.11951/j.issn.1005-0299.20220449 |
| 分类号:O482.22+2 |
| 文献标识码:A |
| 基金项目:国家自然科学基金面上项目(91963111,52071255). |
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| Research progress of thermally conductive graphene-based films |
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CAO Kun, WANG Jingxiao, DONG Chengwei, SHI Qian, TIAN Fanghua, ZHANG Yin, YANG Sen, SONG Xiaoping
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(School of Physics, Xi’an Jiaotong University, Xi’an 710049, China)
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| Abstract: |
| With the rapid development of contemporary technology, heat dissipation and heat conduction have become one of the key bottlenecks restricting the miniaturization of chip devices and the development of high-power manufacturing industry. The further application of traditional metal thermal conductive materials is limited by issues such as high density and easy oxidation. The non-metallic carbon-based materials represented by graphene-based materials have gradually become the focus of thermal conductive materials at home and abroad recently. This article reviews the methods and latest research results of preparing graphene thermal conductive films at home and abroad. This review article probes into the effects of heat treatment process, grain size, film density, impurity atoms and defects on the properties and physical mechanisms of graphene thermal conductive films. In addition, the development trends in this field are discussed |
| Key words: graphene oxide graphene heat conducting sheet defect thermal conductivity |
