| 引用本文: | 刘欣萍,朱晓云,龙晋明.热处理对银包铜粉表面光滑度的影响[J].材料科学与工艺,2024,32(4):40-47.DOI:10.11951/j.issn.1005-0299.20220391. |
| LIU Xinping,ZHU Xiaoyun,LONG Jinming.Effect of heat treatment on surface smoothness of silver coated copper powder[J].Materials Science and Technology,2024,32(4):40-47.DOI:10.11951/j.issn.1005-0299.20220391. |
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| 摘要: |
| 为解决银包铜粉在导电浆料中的应用问题,本文采用化学镀与浸涂法结合制备银包铜粉,通过控制热处理工艺来改善镀银层表面的平整光滑性,并利用扫描电镜、电阻测试仪等研究了热处理工艺对银包铜粉镀银层形貌、抗氧化性、导电性和吸油率的影响。研究发现:采用化学镀与浸涂法结合的方法,可以制备表面更光滑的银包铜粉；随着热处理温度的升高,银层愈加光滑平整；但当热处理温度为700 ℃时,银包铜粉会出现破裂团聚的现象,且随着热处理时间的延长,银包铜粉结构发生畸变和团聚。研究表明,控制热处理工艺可以改善银层表面平整光滑性,从而降低其在电子浆料中的吸油率,提高抗氧化性和导电性。当热处理温度为600 ℃,保温时间10 min时,制备得到的银包铜粉形貌最好,综合性能最佳。 |
| 关键词: 银包铜粉 表面银层 光滑度 热处理工艺 综合性能 |
| DOI：10.11951/j.issn.1005-0299.20220391 |
| 分类号:TB331 |
| 文献标识码:A |
| 基金项目:昆明理工大学分析测试基金资助项目(2019M20182230007). |
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| Effect of heat treatment on surface smoothness of silver coated copper powder |
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LIU Xinping, ZHU Xiaoyun, LONG Jinming
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(Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China)
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| Abstract: |
| To solve the application problem of silver-clad copper powder in conductive paste, the present study prepared silver-clad copper powder by the combination of electroless plating and dipping method. By controlling the heat treatment process, the flatness and smoothness of the surface of the silver plating layer the smooth was improved. By scanning electron microscopy and resistance tester, the effects of heat treatment process on the morphology, oxidation resistance, conductivity and oil absorption rate of the silver-clad copper powder coated layer were investigated. It is found that the combination of electroless plating and dipping method can prepare silver-clad copper powder with a smoother surface. With the increase of heat treatment temperature, the silver layer becomes smoother and flatter. However, when the heat treatment temperature is 700 ℃, the silver-clad copper powder will be cracked and agglomerated. With the extension of the heat treatment time, the structure of the silver-clad copper powder will be distorted and agglomerated. Studies have shown that controlling the heat treatment process can improve the surface smoothness of the silver layer, thereby reducing its oil absorption rate in the electronic paste, and improving oxidation resistance and electrical conductivity. When the heat treatment temperature is 600 ℃ and the holding time is 10 min, the prepared silver-clad copper powder presents the best morphology and comprehensive performance. |
| Key words: silver-coated copper particle silver layer smooth heat treatment parameters comprehensive performance |
