| 引用本文: | 吴娜,韩山玉,张春霞,安娟,夏文堂,刘扬,梁佳,龙刚武.电解液硫酸质量浓度对铜粉性能的影响及生长机制分析[J].材料科学与工艺,2024,32(5):84-89.DOI:10.11951/j.issn.1005-0299.20220389. |
| WU Na,HAN Shanyu,ZHANG Chunxia,AN Juan,XIA Wentang,LIU Yang,LIANG Jia,LONG Gangwu.Effect of electrolyte acidity on copper powder properties and growth mechanism[J].Materials Science and Technology,2024,32(5):84-89.DOI:10.11951/j.issn.1005-0299.20220389. |
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| 电解液硫酸质量浓度对铜粉性能的影响及生长机制分析 |
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吴娜1, 韩山玉2, 张春霞2, 安娟2, 夏文堂2, 刘扬3, 梁佳3, 龙刚武3
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(1.重庆科技大学 化学化工学院, 重庆 401331;2.重庆科技大学 冶金与材料工程学院, 重庆 401331;3.紫金铜业有限公司, 福建 龙岩 364030)
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| 摘要: |
| 具有树枝状结构的超轻铜粉表现出优良的导电性,是制备高端电碳材料不可或缺的关键基础材料,然而其树枝状结构形成过程难以控制,进而限制了树枝状铜粉的广泛应用。本文采用电化学沉积法,以CuSO4+H2SO4电解液体系,在(40±2) ℃条件下制得了微米级超轻树枝状铜粉,研究了超轻铜粉枝晶生长过程以及硫酸质量浓度对其性能的影响。通过SEM、粒度仪、松装密度仪对铜粉进行表征,结果表明:电解液硫酸质量浓度与树枝状发达程度、平均粒度、松装密度呈负相关的关系,与电解能耗呈正相关的关系；同时,氢气的析出对铜粉形成枝晶状结构和阴极表面扩散层的厚度均有重要影响；铜粉的松装密度随电解液硫酸质量浓度增大而降低,在硫酸质量浓度为140 g/L时,电流效率为80.72%,能耗为1 238.6 (kW·h)/t,且铜粉松装密度较小,其值为0.620 4 g/cm3。电沉积树枝状铜粉的枝晶生长主要经历3个阶段:形核生长及扩大-粒子聚集-枝晶生长。 |
| 关键词: 电沉积法 树枝状铜粉 酸浓度 松装密度 形貌 |
| DOI：10.11951/j.issn.1005-0299.20220389 |
| 分类号:TB31 |
| 文献标识码:A |
| 基金项目:国家自然科学基金资助项目(52174331)；重庆市自然科学基金资助项目(CSTB2023NSCQ-MSX0352)；重庆市教委科学技术研究项目(KJQN202001533)；重庆科技学院硕士研究生创新计划项目(YKJCX2120223). |
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| Effect of electrolyte acidity on copper powder properties and growth mechanism |
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WU Na1, HAN Shanyu2, ZHANG Chunxia2, AN Juan2, XIA Wentang2, LIU Yang3, LIANG Jia3, LONG Gangwu3
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(1.School of Chemistry and Chemical Engineering, Chongqing University of Science and Technology, Chongqing 401331, China; 2.School of Metallurgical and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China; 3.Fujian Zijin Copper Co., Ltd., Longyan 364030, China)
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| Abstract: |
| Ultralight copper powder with dendritic structure exhibits excellent electrical conductivity, viewed as an indispensable key base material for the preparation of high-end electro-carbon materials. However, the dendritic structure formation process is difficult to control, preventing from the wide application of dendritic copper powders. In this study, micron-scale ultralight dendritic copper powders were produced by electrochemical deposition with CuSO4+H2SO4 electrolyte system at (40±2) ℃. The effects of the dendrite growth process and sulfuric acid concentration on the properties of ultralight copper powders were investigated. The results showed that the concentration of sulfuric acid in the electrolyte was negatively correlated with the degree of dendrite development, average particle size and loose packing density, and positively correlated with the energy consumption of electrolysis. Meanwhile, the precipitation of hydrogen exerted an important influence on the formation of dendrite structure and the thickness of diffusion layer on the cathode surface; the loose packing density of copper powder decreased with the increase of sulfuric acid concentration in the electrolyte. The current efficiency was 80.72% and the energy consumption was 1 238.6 (kW·h)/t at a sulfuric acid concentration of 140 g/L, and the loose-packed density of copper powder was small, specifically a value of 0.620 4 g/cm3. The dendrite growth of electrodeposited dendritic copper powder mainly goes through three stages: nucleation growth and expansion-particle aggregation-dendrite growth. |
| Key words: electrodeposition dendritic copper powder acid concentration apparent density morphology |
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