| 引用本文: | 李悦,鲍振洲,谢静超,秦宪明.含相变储能材料石膏板的物理力学及热工性能[J].哈尔滨工业大学学报,2013,45(9):88.DOI:10.11918/j.issn.0367-6234.2013.09.016 |
| LI Yue,BAO Zhenzhou,XIE Jingchao,Qin Xianming.Mechanical properties and thermal performance of gypsum wallboards incorporated with composite phase change materials[J].Journal of Harbin Institute of Technology,2013,45(9):88.DOI:10.11918/j.issn.0367-6234.2013.09.016 |
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| 摘要: |
| 为优化掺加相变储能材料(CPCM)的石膏板性能,针对实际应用环境条件,通过正交试验研究了温度、湿度等外界条件的变化对掺加CPCM石膏板的物理力学性能及热工性能的影响．结果表明,试件的抗压强度和抗折强度随着CPCM掺量的增大而降低;随钢纤维掺量或含水率的增大而增加．在不同的温度条件下,各影响因素的变化对导热系数变化的影响主次顺序不同．石膏板内部相对湿度及钢纤维掺量的增加有利于提高其导热系数,而CPCM掺量的增加会降低其导热系数．石膏板的导热系数随着板体初始温度的变化而改变,在CPCM相变温度区间的石膏板导热系数最大． |
| 关键词: 石膏基复合相变材料 物理力学性能 导热系数 正交试验 防护热板法 |
| DOI：10.11918/j.issn.0367-6234.2013.09.016 |
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| 基金项目:国家科技支撑计划资助项目（2011BAE14B06-07）； 厦门市科学技术局科技计划资助项目（3502Z200）. |
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| Mechanical properties and thermal performance of gypsum wallboards incorporated with composite phase change materials |
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LI Yue1,BAO Zhenzhou1,XIE Jingchao1,Qin Xianming2
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(1.The Key Lab of Urban Security ＆ Disaster Engineering, Beijing University of Technology, 100124 Beijing, China; 2 Xiamen Hongye Construction Technology Co., Ltd., 361012 Xiamen, Fujian, China)
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| Abstract: |
| To optimize the properties of gypsum wallboards incorporated with Composite Phase Change Material (CPCM), orthogonal test was used, and according to the practical conditions, the mechanical properties and thermal performance of gypsum wallboards incorporated with CPCM were studied. The results show that, the compression and flexural strength of gypsum board decreases with the increase of CPCM content, and increases with the increase of steel fiber content or moisture content. Under different temperature conditions, the influence of various factors on the thermal conductivity is in a different order. Increasing internal relative humidity and steel fiber dosage, leads to increase in the thermal conductivity, but increasing the CPCM content leads to decrease the thermal conductivity. The thermal conductivity of gypsum board is dependent on the initial board temperature. The maximum thermal conductivity appears in the phase transition temperature interval of CPCM. |
| Key words: gypsum board incorporated with CPCM mechanical properties thermal conductivity orthogonal test protection hot plate method
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