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主管单位 中华人民共和国
工业和信息化部
主办单位 中国材料研究学会
哈尔滨工业大学
主编 苑世剑 国际刊号ISSN 1005-0299 国内刊号CN 23-1345/TB

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引用本文:杜超,刘翠荣,阴旭,赵浩成.阳极键合研究现状及影响因素[J].材料科学与工艺,2018,26(5):82-88.DOI:10.11951/j.issn.1005-0299.20170313.
DU Chao,LIU Cuirong,YIN Xu,ZHAO Haocheng.Research status and influencing factors of anodic bonding[J].Materials Science and Technology,2018,26(5):82-88.DOI:10.11951/j.issn.1005-0299.20170313.
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阳极键合研究现状及影响因素
杜超,刘翠荣,阴旭,赵浩成
(太原科技大学 材料科学与工程学院,太原 030024)
摘要:
为了提高键合质量、优化键合材料,促进阳极键合技术在工业生产中的应用,本文以“硅/玻璃”的阳极键合为例,阐述了阳极键合作为新型连接工艺的键合机理及工艺过程,介绍了现阶段阳极键合在国内外工业生产中的应用实例及相关研究,尤其是在微电子封装领域所展现的杰出应用前景,同时结合阳极键合过程中对键合参数、材料处理等要求,给出了影响键合质量的各种因素,以及在键合过程中常出现的问题及其解决办法.本文立足于键合机理及键合工艺过程,结合不同材料特性,重点阐述了阳极键合这一新型连接工艺的国内外研究现状及影响键合的因素,为进一步提高键合质量、优化键合工艺、开发新的键合材料等提供理论依据.
关键词:  阳极键合  键合工艺  键合应用  研究现状  影响因素
DOI:10.11951/j.issn.1005-0299.20170313
分类号:TG496
文献标识码:A
基金项目:国家自然科学基金资助项目(51275332).
Research status and influencing factors of anodic bonding
DU Chao,LIU Cuirong,YIN Xu,ZHAO Haocheng
(School of Material Science and Engineering, Taiyuan University of Science and Technology, Taiyuan 030024, China)
Abstract:
Anodic bonding as a reliable and clean connection process has been widely used in the production and packaging of MEMS devices. However, the miniaturization of electronic manufacturing technology and functional diversification increases the complexity of MEMS system package gradually. In order to improve the bonding quality, optimize the bonding material, and promote the anode bonding technology in industrial production applications, in this paper, by using the "silicon/glass" anode bonding as an example, we describe the bonding mechanism and bonding process, introduce some applications and related research of anodic bonding in industrial production at home and abroad, especially in the field of microelectronics packaging. At the same time, combined with the requirements of bonding parameters and material handling during the process of anode bonding, the factors influencing of the bonding quality are discussed, and some problems and solutions in the bonding process are given. Further, based on the bonding mechanism and the bonding process combined with the characteristics of different materials, we focus on the summary of the anode bonding at home and abroad and the status quo and the impact of bonding factors. It is also provide a theoretical basis for improving the bonding quality, optimizing the bonding process and developing new bonding materials.
Key words:  anodic bonding  bonding process  bonding application  research status  influencing factors

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