| 引用本文: | 高堂铃,付刚,王先杰,王冠,何影翠,匡弘.RTM用低黏度树脂体系的工艺窗口预测[J].哈尔滨工业大学学报,2021,53(2):162.DOI:10.11918/202008011 |
| GAO Tangling,FU Gang,WANG Xianjie,WANG Guan,HE Yingcui,KUANG Hong.Prediction of processing windows for low viscosity epoxy resin system used in RTM[J].Journal of Harbin Institute of Technology,2021,53(2):162.DOI:10.11918/202008011 |
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| RTM用低黏度树脂体系的工艺窗口预测 |
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高堂铃1,3,付刚1,3,王先杰2,王冠1,3,何影翠1,匡弘1,3
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(1.黑龙江省科学院 石油化学研究院,哈尔滨 150040; 2.哈尔滨工业大学 物理学院,哈尔滨 150001; 3.黑龙江省科学院 高技术研究院,哈尔滨 150020)
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| 摘要: |
| 为有效预测低黏度环氧树脂体系TQ-50的流变黏度变化规律并确定其在树脂传递模塑（RTM）工艺中的适宜工艺窗口,本文采用差示扫描量热仪（DSC）、黏度计、流变仪和凝胶时间测试仪对TQ-50树脂体系的固化反应特性、静态黏度、动态黏度和凝胶时间等性能进行了系统的研究.在实验结果的基础上,利用双阿累尼乌斯方程（Arrhenius）建立该树脂体系的静态流变模型,该流变模型与实验结果具有良好的拟合一致性,能够准确地描述TQ-50环氧树脂在较低黏度范围内的化学流变行为.利用该流变模型建立温度、时间和黏度三维预测图谱和温度、时间等黏度曲线,并对工艺窗口进行预测,为工艺参数的优化提供科学依据.研究结果表明:TQ-50低黏度环氧树脂体系的黏度低于500 mPa·s时,工艺窗口的温度可选范围为50~70 ℃,保持时间约为150~180 min,黏度低于200 mPa·s时,工艺窗口温度的可选范围为55~70 ℃,保持时间约为56~96 min,该树脂体系具有较宽的适宜注射温度范围和较长的注射时间,满足RTM工艺成型的基本要求. |
| 关键词: 树脂传递模塑（RTM） 环氧树脂 流变模型 工艺窗口 低黏度 复合材料 |
| DOI：10.11918/202008011 |
| 分类号:TU398+.9 |
| 文献标识码:A |
| 基金项目:国家自然科学基金(51902091) |
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| Prediction of processing windows for low viscosity epoxy resin system used in RTM |
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GAO Tangling1,3,FU Gang1,3,WANG Xianjie2,WANG Guan1,3,HE Yingcui1,KUANG Hong1,3
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(1.Institute of Petrochemistry, Heilongjiang Academy of Sciences, Harbin 150040, China; 2.School of Physics, Harbin Institute of Technology, Harbin 150001, China; 3.Institute for Advanced Technology, Heilongjiang Academy of Sciences, Harbin 150020, China)
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| Abstract: |
| In order to efficiently predict the rheological viscosity of low viscosity epoxy resin TQ-50 and determine suitable processing window in resin transfer molding (RTM) process, the properties of TQ-50 resin system including curing reaction characteristics, static viscosity, dynamic viscosity, and gel time were systematically investigated by using differential scanning calorimetry (DSC), viscometer, rheometer, and gel time tester. Based on the experimental results, the static rheological model of TQ-50 was established by using Arrhenius equation. It was found that the rheological model was well consistent with the experimental results and could accurately describe the chemical rheological behavior of TQ-50 in low viscosity range. On the basis of the rheological model, three-dimensional prediction maps of temperature, time, and viscosity as well as viscosity curves of temperature and time were established, and the processing window was predicted, which provided guidance for the optimization of process parameters. Results show that when the viscosity was lower than 500 mPa·s, the optional processing window temperature was 50~70 ℃, and the holding time was about 150~180 min. When the viscosity was lower than 200 mPa·s, the optional range window temperature was 55~70 ℃, and the holding time was about 56~96 min. The resin system has a wider range of suitable injection temperature and longer injection time, which can meet the basic requirements of RTM processing. |
| Key words: resin transfer molding (RTM) epoxy resin rheological model processing window low viscosity composite material |
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